6-[2-(2,4-Dimethyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine | 39102-37-9

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 6-[2-(2,4-Dimethyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine
• 英文别名: 6-[2-(2,4-dimethylimidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine
• CAS: 39102-37-9
• 化学式: C₁₀H₁₅N₇
• 分子量: 233.27
• InChiKey: NHANUEMZKFWPIB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.1
• 重原子数：
  17
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  109
• 氢给体数：
  2
• 氢受体数：
  6

文献信息

• Polyamic acid varnish composition and a flexible printed board
  申请人：Sony Chemicals Corporation

  公开号：EP1108762A2

  公开（公告）日：2001-06-20

  A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.

  一种聚酰胺酸清漆组合物，由二胺和芳香酸二酐加成聚合得到的聚酰胺酸组成，其中含有一种特定的咪唑基二氨基嗪作为添加剂。
• Flexible printed substrate
  申请人：Sony Chemicals Corporation

  公开号：EP1111972A2

  公开（公告）日：2001-06-27

  A flexible printed substrate is constituted of metallic foil and provided thereon a polyimide layer which is produced by forming a film of a polyamic acid varnish on the metallic foil, followed by imidating. The polyimide layer has a linear expansion coefficient of 10×10-6 to 30× 10-6 (1/K) and a softening point not more than the imidation temperature.

  柔性印刷基板由金属箔构成，其上有一层聚酰亚胺层，聚酰亚胺层是通过在金属箔上形成一层聚胺基酸清漆薄膜，然后进行酰亚胺化而制成的。聚酰亚胺层的线膨胀系数为 10×10-6 至 30×10-6 (1/K)，软化点不高于酰亚胺化温度。
• Flexible printed board, polyamic acid and polyamic acid varnish containing same
  申请人：Sony Chemicals Corporation

  公开号：EP1014765B1

  公开（公告）日：2003-03-12
• Enamel Varnish Composition For Enamel Wire And Enamel Wire Using The Same
  申请人：Lee Joon-Hee

  公开号：US20080176072A1

  公开（公告）日：2008-07-24

  Disclosed are enamel varnish compositions for an enamel wire and an enamel wire using the same. The present invention relates to enamel varnish compositions for an enamel wire in which a polymeric resin component is included in an organic solvent, wherein the polymeric resin component includes a first polyamideimide resin, presented in the Chemistry FIG. 1; and a second resin having polyamideimide in which a triazine ring is introduced into a major chain. The enamel wire, in which such a coating pigment composition is applied to the innermost insulated coating layer contacted with the conducting wire, shows the increased adhesivity of the insulated coating layer to the conducting wire without forming an additional bonding layer, as well as the excellent physical properties such as the wear resistance and flexibility, etc.
• ENAMEL VARNISH COMPOSITION FOR ENAMEL WIRE AND ENAMEL WIRE USING SAME
  申请人：Lee Joon-Hee

  公开号：US20090202830A1

  公开（公告）日：2009-08-13

  Disclosed are enamel varnish compositions for an enamel wire and an enamel wire using the same. The present invention relates to enamel varnish compositions for an enamel wire in which a polymeric resin component is included in an organic solvent, wherein the polymeric resin component includes a first polyamideimide resin; and a second resin having polyamideimide in which a triazine ring is introduced into a major chain. The enamel wire, in which such a coating pigment composition is applied to the innermost layer, has the increased adhesivity of the insulated coating layer to the conducting wire, as well as the excellent physical properties such as the wear resistance and flexibility, etc.