2-phenyl-4-benzyl-5-hydroxymethylimidazole | 61698-33-7

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 2-phenyl-4-benzyl-5-hydroxymethylimidazole
• 英文别名: (5-Benzyl-2-phenyl-1H-imidazol-4-yl)methanol
• CAS: 61698-33-7
• 化学式: C₁₇H₁₆N₂O
• 分子量: 264.327
• InChiKey: ZMAMKNPVAMKIIC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.8
• 重原子数：
  20
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.12
• 拓扑面积：
  48.9
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• Epoxy resin composition
  申请人：SHIKOKU CHEMICALS CORPORATION

  公开号：EP0166588A1

  公开（公告）日：1986-01-02

  An epoxy resin composition comprising an epoxy resin, either 2-vinyl-4,6-diamino-s-triazine or 2-vinyl-4,6-diamino--s-triazine/isocyanuric acid adduct, and at least one compound selected from dicyanidamide, polyvinyl-p-phenol and specific imidazole compounds is useful, for example, in inks, insulating paints and adhesives for printed circuit base boards and in copper-clad laminated boards.

  环氧树脂组合物由环氧树脂、2-乙烯基-4,6-二氨基-s-三嗪或 2-乙烯基-4,6-二氨基-s-三嗪/异氰尿酸加合物以及至少一种选自双氰胺、聚乙烯基苯酚和特定咪唑化合物的化合物组成。
• 2-substituted-4, 6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct
  申请人：SHIKOKU CHEMICALS CORPORATION

  公开号：EP0194895A2

  公开（公告）日：1986-09-17

  Disclosed is a 2-substituted-4, 6-diamino-s-triazins/ isocyanuric acid adduct represented by the following formula: wherein R stands for an alkyl group having 2 to 20 carbon atoms, an unsubstituted or cyano group-substituted aryl group, or a group of the formula R1-CH2CH2- in which R' stands for an alkoxy group having up to 20 carbon atoms, an acyloxy group, an amino group, an N-substituted amino group, a benzotriazolyl group or a 2-alkylimidazolyl-(4)-dithiocarbonyl group, or by the following formula: wherein R2 -(CH2)m-(X)p-(CH2)m- where m is 1 or 2 p is 0 or 1 and X is imino or phenylene. When this adduct is used for curing a polyepoxy resin, a cured product having good heat resistance, insulating property and adhesion and an excellent migration-preventing effect is formed.

  本发明公开了由下式表示的 2-取代-4，6-二氨基-s-三嗪/异氰尿酸加合物： 其中R代表具有2至20个碳原子的烷基、未取代或氰基取代的芳基、或式R1-CH2CH2-的基团，其中R'代表具有多达20个碳原子的烷氧基、酰氧基、氨基、N-取代的氨基、苯并三唑基或2-烷基咪唑基-(4)-二硫代羰基，或由下式表示： 其中 R2-(CH2)m-(X)p-(CH2)m- 其中 m 为 1 或 2 p 是 0 或 1，以及 X 是亚氨基或亚苯基。 使用这种加成物固化聚环氧树脂时，可形成具有良好耐热性、绝缘性和粘合性以及优异防迁移效果的固化产品。
• Acid anhydride-containing one package epoxy resin composition
  申请人：Ajinomoto Co., Inc.

  公开号：EP0615994A1

  公开（公告）日：1994-09-21

  An acid anhydride-containing one package epoxy resin composition consisting indispensably of (1) an epoxy resin having two or more epoxy groups in one molecule, (2) an acid anhydride, (3) at least one of (a) a liquid latent curing accelerator, (b) a latent curing accelerator soluble in an epoxy resin having two or more epoxy groups in one molecule and (c) a latent curing accelerator soluble in an acid anhydride and (4) a dispersible latent curing accelerator, in which the ratio of (1) to (2) is from 0.8 to 1.2 as (the number of acid anhydride equivalent)/(the number of epoxy equivalent) and the amounts of (3) and (4) each are from 0.1 to 10 parts by weight to 100 parts by weight of the epoxy resin. The composition has excellent infiltrability, storage stability and reactivity.

  一种含酸酐的一包环氧树脂组合物，其组成不可或缺地包括：(1) 分子中含有两个或两个以上环氧基团的环氧树脂；(2) 酸酐；(3) (a) 液体潜伏固化促进剂中的至少一种、(c) 可溶于酸酐的潜在固化促进剂和 (4) 可分散的潜在固化促进剂中的至少一种，其中 (1) 与 (2) 的比例为 0.8至1.2，即（酸酐当量数）/（环氧当量数），(3)和(4)的用量各为 0.1 至 10 重量份对 100 重量份环氧树脂。 该组合物具有优异的浸润性、储存稳定性和反应活性。
• Adhesive tape for electronic parts and liquid adhesive
  申请人：TOMOEGAWA PAPER CO. LTD.

  公开号：EP0649892A1

  公开（公告）日：1995-04-26

  This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same. The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.

  本发明旨在提供一种可在相对较低温度下粘合和固化并具有足够耐热性和可靠性等优点的本发明液体粘合剂，以及使用该粘合剂的胶带。 本发明的液体粘合剂可通过溶解 (a) 含哌嗪基乙基氨基羰基的丁二烯-丙烯腈共聚物来获得，该共聚物的重量平均分子量为 10,000-200,000 ，丙烯腈含量为 5-50%（重量百分比），氨基当量为 500-10,000 ，由下式(I)表示： 其中，k、m 和 n 为摩尔比，取 n 为 1，k 为 3-175 的数值，m 为 0.3 至 93 的数值；以及 (b) 具有至少两个马来酰亚胺基团的化合物，组分(b)与 100 重量份组分(a)的比率为 10 至 900 重量份。将其涂在耐热薄膜的一个表面或两个表面上，或涂在离型膜的一个表面上，形成粘合层，从而获得用于电子零件的胶带。
• Adhesive for semiconductor device and reinforcing material using the same
  申请人：TOMOEGAWA PAPER CO. LTD.

  公开号：EP0660407A1

  公开（公告）日：1995-06-28

  An adhesive (7) for bonding a reinforcing sheet (8) to a lead-formed surface (9), especially in a tape carrier package used for forming a semiconductor device (2), the adhesive (7) being a resin composition which constitutes an interlayer between the lead-formed surface (9) and the reinforcing sheet (8), comprises a polyamide resin having an amine value of 3.0 to 50 and an epoxy resin. The adhesive layer (7) is free from peeling and foaming, undergoes sufficient softening and curing at a temperature lower than about 150°C, has high insulation reliability after curing, and has heat resistance against a temperature up to 260°C.

  一种用于将加强片（8）粘合到铅成形表面（9）上的粘合剂（7），特别是在用于形成半导体器件（2）的胶带载体封装中，粘合剂（7）是一种树脂组合物，构成铅成形表面（9）和加强片（8）之间的中间层，包括胺值为 3.0 至 50 的聚酰胺树脂和环氧树脂。粘合剂层（7）不会剥落和起泡，在低于约 150°C 的温度下可充分软化和固化，固化后绝缘可靠性高，耐热温度高达 260°C。