1-Heptadecyl-1H-imidazole | 25268-79-5

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 1-Heptadecyl-1H-imidazole
• 英文别名: 1-heptadecylimidazole
• CAS: 25268-79-5
• 化学式: C₂₀H₃₈N₂
• 分子量: 306.5
• InChiKey: GITHFJGZCMUMOI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  8.2
• 重原子数：
  22
• 可旋转键数：
  16
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.85
• 拓扑面积：
  17.8
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• IONIC LIQUID, LUBRICANT, AND MAGNETIC RECORDING MEDIUM
  申请人：DEXERIALS CORPORATION

  公开号：US20170298285A1

  公开（公告）日：2017-10-19

  A lubricant, which includes an ionic liquid including a conjugate base and a conjugate acid, wherein the conjugate acid is represented by General Formula (A) below, and wherein a pKa of an acid that is a source of the conjugate base in acetonitrile is 10 or less, where, in General Formula (A), R 1 , R 2 , and R 3 are each independently a group including a hydrocarbon group, with the proviso that at least one of the hydrocarbon groups in R 1 , R 2 , and R 3 is a straight-chain hydrocarbon group having 6 or greater carbon atoms.

  一种润滑剂，其中包括一种包括共轭碱和共轭酸的离子液体，其中所述共轭酸由下面的通用公式（A）表示，并且在乙腈中作为共轭碱来源的酸的pKa为10或更低，其中，在通用公式（A）中，R1、R2和R3分别独立地是包括烃基的基团，但至少其中一个在R1、R2和R3中的烃基是具有6个或更多碳原子的直链烃基。
• Epoxy resin composition
  申请人：SUNSTAR GIKEN KABUSHIKI KAISHA

  公开号：EP0264882A2

  公开（公告）日：1988-04-27

  Epoxy resin composition comprising a uniform mixture of an epoxy resin and fine particles of a rubber adhered uniformly on the surface thereof with fine particles of an inorganic material, said composition having improved peel strength and toughness when cured and being useful as an adhesive or a molding material.

  环氧树脂组合物，由环氧树脂和橡胶细颗粒的均匀混合物组成，橡胶细颗粒与无机材料的细颗粒均匀地粘附在环氧树脂的表面，所述组合物在固化时具有更好的剥离强度和韧性，可用作粘合剂或成型材料。
• Hardener for curable one-package epoxy resin system
  申请人：Asahi Kasei Kogyo Kabushiki Kaisha

  公开号：EP0304503A1

  公开（公告）日：1989-03-01

  A master batch of hardener for curable one-­package epoxy resin system which comprises (I) a hardener consisting of (I) a hardener consisting of (i) a powder of an amine compound (A) as a core having at least one tertiary amino group in the molecule while having no primary and secondary amino groups, the powder having both a group (X) capable of absorbing infrared rays of 1630 to 1680 cm⁻¹ in wave length and a group (Y) capable of absorbing infrared rays of 1680 to 1725 cm⁻¹ in wave length at least on the surface of the powder, and (ii) a reaction product of the amine compound (A) and an epoxy resin as a shell; and (II) an epoxy resin (B) in a ratio of 10 to 50,000 parts by weight to 100 parts by weight of the hardener (I). A hardener containing the master batch is also disclosed.

  一种用于固化单组分环氧树脂体系的母料固化剂，它包括 (I) 由以下成分组成的固化剂 (I) 由以下成分组成的固化剂 (i) 以胺化合物（A）为核心的粉末，其分子中至少有一个叔氨基，而没有伯氨基和仲氨基，该粉末的表面至少有一个能吸收波长为 1630 至 1680 厘米-¹的红外线的基团（X）和一个能吸收波长为 1680 至 1725 厘米-¹的红外线的基团（Y），和 (ii) 作为外壳的胺化合物（A）和环氧树脂的反应产物；以及 (II) 环氧树脂 (B)，其重量比为 10 至 50,000 份与固化剂 (I) 的重量比为 100 份。 还公开了一种含有母料的固化剂。
• Thermosetting resin composition, and prepreg and laminated sheet which use the same
  申请人：HITACHI, LTD.

  公开号：EP0315211A1

  公开（公告）日：1989-05-10

  The present invention provide a thermosetting resin composition comprising (a) a prepolymer of a poly (p-hydroxystyrene) derivative represented by the general formula wherein A is a halogen group, R₁ is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100, (b) an epoxy-modified polybutadiene, and (c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.

  本发明提供了一种热固性树脂组合物，其中包括 (a) 由通式表示的聚(对羟基苯乙烯)衍生物的预聚物 其中 A 为卤素基团，R₁ 为 2 至 4 个碳原子的烯基或烯酰基，m 表示 1 至 4 的数字，n 表示 1 至 100 的数字、 (b) 环氧改性聚丁二烯，和 (c) 芳香族马来酰亚胺化合物，以及使用上述树脂组合物的预浸料和层压板。
• Epoxy resin composition and semiconductor sealing material comprising same
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0379172A2

  公开（公告）日：1990-07-25

  Disclosed is an epoxy resin composition comprising, as basic components, (A) an epoxy resin, (B) a phenol-novolak resin, (C) a curing promotor and (D) a filler. Pulverized or spherical silica having specific particle size characteristics is used as the filler (D). Preferably, a halogenated epoxy resin and antimony oxide are further incorporated in this epoxy resin. This epoxy resin composition shows a very small molding shrinkage. If a dialkylurea derivative is used as the curing promotor (C), the stability of the composition at about 100°C is drastically improved and the flowability of the composition is improved. Accordingly, precision injection molding becomes possible, and the effect of sealing a semiconductor is enhanced.

  本发明公开了一种环氧树脂组合物，其基本成分包括：(A) 环氧树脂；(B) 苯酚-Novolak 树脂；(C) 固化促进剂；(D) 填料。填料 (D) 采用具有特定粒度特性的粉状或球状二氧化硅。环氧树脂中最好再加入卤化环氧树脂和氧化锑。这种环氧树脂组合物的成型收缩率非常小。如果使用二烷基脲衍生物作为固化促进剂 (C)，组合物在约 100°C 时的稳定性会大大提高，组合物的流动性也会得到改善。因此，精密注塑成型成为可能，密封半导体的效果也得到增强。