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methaneylpropenoic acid-2-hydroxy-1,1-dimethylethyl ester

中文名称
——
中文别名
——
英文名称
methaneylpropenoic acid-2-hydroxy-1,1-dimethylethyl ester
英文别名
methylpropaneenoic acid-2-hydroxy-1,1-dimethylethyl ester;methylpropenoic acid 2-hydroxy-1,1-dimethaneylethyl ester;(methyl)propenoic acid 1,1-dimethyl-2-hydroxyethyl ester;methylpropenoic acid 2-hydroxy-1,1-dimethylethyl ester;methylpropaneenoic acid hydroxytert-butyl ester;methylpropeneic acid dimethylhydroxyethyl ester;methylpropenoic acid dimethylhydroxyethyl ester;methylpropenoic acid hydroxytert-butyl ester;2-hydroxy-1,1-dimethylethyl methacrylate;methacrylic acid hydroxytert-butyl ester;dimethylhydroxyethyl (meth)acrylate;(1-Hydroxy-2-methylpropan-2-yl) 2-methylprop-2-enoate
methaneylpropenoic acid-2-hydroxy-1,1-dimethylethyl ester化学式
CAS
——
化学式
C8H14O3
mdl
——
分子量
158.197
InChiKey
AMAJLCUZXGYMRO-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    1.5
  • 重原子数:
    11
  • 可旋转键数:
    4
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.62
  • 拓扑面积:
    46.5
  • 氢给体数:
    1
  • 氢受体数:
    3

反应信息

点击查看最新优质反应信息

文献信息

  • Processes for producing (meth)acrylic acid compound
    申请人:MITSUBISHI CHEMICAL CORPORATION
    公开号:US20040267045A1
    公开(公告)日:2004-12-30
    A first and second aspect of the invention relate to a process for producing a (meth)acrylic acid compound and a process for producing a (meth)acrylic ester, respectively. In particular, the second aspect of the invention relates to a process for (meth)acrylic ester production which includes a step in which by-products of a (meth)acrylic ester-yielding reaction are decomposed to recover a (meth)acrylic ester. A third aspect of the invention relates to a method of decomposing by-products of (meth)acrylic ester production in order to recover (meth)acrylic acid, a (meth)acrylic ester, and an alcohol through the decomposition of the by-products of (meth)acrylic ester production. A fourth and fifth aspect of the invention relate to a method of decomposing by-products of (meth)acrylic acid compound production in order to recover (meth)acrylic acid, a (meth)acrylic ester, and an alcohol through the decomposition of by-products of (meth)acrylic acid production and by-products of (meth)acrylic ester production.
    本发明的第一和第二方面涉及分别生产(甲基)丙烯酸化合物和生产(甲基)丙烯酸酯的过程。特别是,本发明的第二方面涉及一种(甲基)丙烯酸酯生产过程,其中包括一步骤,通过该步骤,(甲基)丙烯酸酯产生反应的副产物被分解以回收(甲基)丙烯酸酯。本发明的第三方面涉及一种分解(甲基)丙烯酸酯生产的副产物以回收(甲基)丙烯酸、(甲基)丙烯酸酯和醇的方法,通过分解(甲基)丙烯酸酯生产的副产物来实现。本发明的第四和第五方面涉及一种分解(甲基)丙烯酸化合物生产的副产物以回收(甲基)丙烯酸、(甲基)丙烯酸酯和醇的方法,通过分解(甲基)丙烯酸和(甲基)丙烯酸酯生产的副产物来实现。
  • Ink composition, and inkjet recording method
    申请人:FUJIFILM Corporation
    公开号:EP2298841A1
    公开(公告)日:2011-03-23
    An ink composition comprising: (A) an isoindoline-based pigment; (B) a pigment dispersing agent; (C) a radically polymerizable compound; and (D) a polymerization initiator; the radically polymerizable compound (C) comprising at least one compound selected from the group consisting of compounds represented by Formula (I) to Formula (III): wherein R1, A1, R2, m, R3, A2 and n are as defined in the description.
    一种油墨组合物,包括 (A) 异吲哚啉颜料; (B) 颜料分散剂 (C) 可辐射聚合的化合物;以及 (D) 聚合引发剂; 可辐射聚合的化合物(C)包括至少一种选自由式(I)至式(III)所代表的化合物组成的化合物组: 其中 R1、A1、R2、m、R3、A2 和 n 如说明中所定义。
  • PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE
    申请人:Toray Industries, Inc.
    公开号:EP3267254A1
    公开(公告)日:2018-01-10
    Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.
    本发明提供了一种光敏树脂组合物,其中含有:一种或多种选自聚酰亚胺、聚苯并恶唑、聚酰亚胺前体、聚苯并恶唑前体和两种或多种选自前述物质的聚合物形成的共聚物的碱溶性树脂;以及一种光敏剂。光敏树脂组合物还含有通式(1)所代表的化合物。即使在低温下烧制固化薄膜,光敏树脂组合物也能与属材料,特别是,表现出优异的粘合性能,并具有很高的耐化学性。
  • HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR MANUFACTURING HEAT-RESISTANT RESIN FILM, METHOD FOR MANUFACTURING INTERLAYER INSULATION FILM OR SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR COMPONENT
    申请人:Toray Industries, Inc.
    公开号:EP3284771A1
    公开(公告)日:2018-02-21
    The purpose of the present invention is to provide a heat-resistant resin composition having excellent stepped embedding properties on a support substrate. In order to achieve the aforementioned purpose, the present invention is configured as described below. Specifically, the present invention is a heat-resistant resin composition containing: as a resin (A) one or more types of resin selected from the group consisting of a polyimide precursor, and a polybenzoxazole precursor; as an organic solvent (B) an organic solvent having a boiling point of 210°C to 260°C at atmospheric pressure; and as an organic solvent (C) an organic solvent having a boiling point of 100°C to less than 210°C at atmospheric pressure; the content of the organic solvent (B) being 5% by mass to 70% by mass with respect to the entire amount of the organic solvents, and the content of the organic solvent (C) being 30% by mass to 95% by mass with respect to the entire amount of the organic solvents.
    本发明的目的是提供一种耐热树脂组合物,该组合物在支撑基材上具有优异的阶梯嵌入特性。为了实现上述目的,本发明的结构如下所述。具体地说,本发明是一种耐热树脂组合物,其中含有作为树脂(A)从聚酰亚胺前体和聚苯并恶唑前体组成的组中选出的一种或多种树脂; 作为有机溶剂(B)在常压下沸点为 210℃至 260℃的有机溶剂;以及 作为有机溶剂(C)在常压下沸点为 100℃至 210℃以下的有机溶剂;有机溶剂(B)的含量为有机溶剂总量的 5%至 70%,有机溶剂(C)的含量为有机溶剂总量的 30%至 95%。
  • Tert-amine core-bearing acyrlamides and adhesive formulations
    申请人:OREGON HEALTH & SCIENCE UNIVERSITY
    公开号:US10689329B2
    公开(公告)日:2020-06-23
    The present invention provides tertiary amine core-bearing acrylamides and their use in adhesive formulations, particularly including dental adhesives.
    本发明提供了以叔胺为核心的丙烯酰胺及其在粘合剂配方中的用途,特别是包括牙科粘合剂。
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