1,1-bis(3-phenyl-4-hydroxyphenyl)-1,1-diphenylmethane

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: 1,1-bis(3-phenyl-4-hydroxyphenyl)-1,1-diphenylmethane
• 英文别名: 4-[(4-Hydroxy-3-phenylphenyl)-diphenylmethyl]-2-phenylphenol
• 化学式: C₃₇H₂₈O₂
• 分子量: 504.628
• InChiKey: XHNBSKVPGDXZCU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  9.5
• 重原子数：
  39
• 可旋转键数：
  6
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.03
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  碳酸乙烯酯 、 1,1-bis(3-phenyl-4-hydroxyphenyl)-1,1-diphenylmethane 在 四丁基溴化铵 、 potassium hydroxide 作用下， 以 正丁醇 为溶剂， 反应 44.0h， 以10.7 g的产率得到1,1-bis[4-(2-hydroxyethoxy)-3-phenylphenyl]-1,1-diphenylmethane
  参考文献：
  名称：

  TW2016/9622

  摘要：

  公开号：
• 作为产物：
  描述：

  二氯二苯甲烷 、 邻苯基苯酚 以 5,5-dimethyl-1,3-cyclohexadiene 为溶剂， 反应 34.5h， 以12.9 g的产率得到1,1-bis(3-phenyl-4-hydroxyphenyl)-1,1-diphenylmethane
  参考文献：
  名称：

  TW2016/9622

  摘要：

  公开号：

文献信息

• Polyformal resins and process for producing said resins
  申请人：IDEMITSU KOSAN COMPANY LIMITED

  公开号：EP0277627A1

  公开（公告）日：1988-08-10

  Polyformal resins having a repeating unit represented by the general formula: (wherein the symbols are as defined in the appended claims) and an intrinsic viscosity at 20°C as a methylene chloride solution of at least 0.2 dl/g, and a process for efficiently producing the polyformal resins. The present polyformal resins are excellent in heat resistance and optical properties, and thus are useful as materials for produc­tion of optical instruments, for example.

  聚甲醛树脂，其重复单元由通式： (其中符号如所附权利要求中定义)，且在 20℃时二氯甲烷溶液的固有粘度至少为 0.2 分升/克，以及一种高效生产聚甲醛树脂的工艺。本发明的聚甲醛树脂具有优异的耐热性和光学性能，因此可用作生产光学仪器等的材料。
• PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
  申请人：Toray Industries, Inc.

  公开号：EP3203320A1

  公开（公告）日：2017-08-09

  To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A), wherein the polysiloxane (A) is a polysiloxane represented by the general formula (1), and wherein (X) and (Y) are represented by the general formulas (4) to (6). 7.5≤X≤75 2.5≤Y≤40 1.5×Y≤X≤3×Y

  提供一种光敏树脂组合物，该组合物能够形成具有高分辨率的图案并获得具有优异的耐热性和抗裂性的固化膜，而且还可进行碱显影；提供一种方法，该方法能够缩短在半导体衬底上形成杂质区后去除该组合物固化膜所需的步骤；以及提供一种使用该组合物制造半导体器件的方法。公开了一种包括聚硅氧烷(A)的光敏树脂组合物，其中聚硅氧烷(A)是由通式(1)表示的聚硅氧烷，且(X)和(Y)由通式(4)至(6)表示。7.5≤x≤75 2.5≤y≤40 1.5×y≤x≤3×y
• FILM, LAMINATE, THERMOFORMED BODY, IN-MOLD MOLDING, METHOD FOR PRODUCING MOLDING, AND METHOD FOR PRODUCING IN-MOLD MOLDING
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP3954729A1

  公开（公告）日：2022-02-16

  Provided is a film including a polycarbonate resin capable of achieving excellent drawdown resistance during thermoforming and excellent formability in processing a bent portion and the like thereof. THe film contains a polycarbonate resin (a) which satisfies the following expression (i), when a viscosity at a shear rate of 6.080 × 10 [l/s] measured at 300°C is X [Pa·s] and a viscosity at a shear rate of 6.080 × 103 [l/s] measured at 300°C is Y [Pa·s]. −0.69

  本发明提供了一种包含聚碳酸酯树脂的薄膜，该薄膜能够在热成型过程中获得优异的抗拉伸性，并在加工弯曲部分等时获得优异的成型性。该薄膜含有聚碳酸酯树脂 (a)，当在 300°C 测量的剪切速率为 6.080 × 10 [l/s] 时的粘度为 X [Pa-s] 和在 300°C 测量的剪切速率为 6.080 × 103 [l/s] 时的粘度为 Y [Pa-s] 时，该聚碳酸酯树脂 (a) 满足以下表达式 (i)。−0.69
• Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10409163B2

  公开（公告）日：2019-09-10

  To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).

  提供一种光敏树脂组合物，该组合物能够形成高分辨率的图案并获得具有优异耐热性和抗裂性的固化膜，而且还可进行碱显影；提供一种方法，该方法能够缩短在半导体衬底上形成杂质区后去除该组合物固化膜所需的步骤；以及提供一种使用该组合物制造半导体器件的方法。本发明公开了一种包括聚硅氧烷（A）的光敏树脂组合物。
• Compound, resin, composition, resist pattern formation method, and circuit pattern formation method
  申请人：Mitsubishi Gas Chemical Company, Inc.

  公开号：US11130724B2

  公开（公告）日：2021-09-28

  The present invention employs a compound represented by the following formula (0): wherein RY is a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms or an aryl group of 6 to 30 carbon atoms; RZ is an N-valent group of 1 to 60 carbon atoms or a single bond; each RT is independently an alkyl group of 1 to 30 carbon atoms optionally having a substituent, an aryl group of 6 to 40 carbon atoms optionally having a substituent, an alkenyl group of 2 to 30 carbon atoms optionally having a substituent, an alkoxy group of 1 to 30 carbon atoms optionally having a substituent, a halogen atom, a nitro group, an amino group, a cyano group, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, wherein the alkyl group, the alkenyl group, and the aryl group each optionally contain an ether bond, a ketone bond, or an ester bond, wherein at least one RT is a hydroxy group or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; X is an oxygen atom, a sulfur atom, or not a crosslink; each m is independently an integer of 0 to 9, wherein at least one m is an integer of 1 to 9; N is an integer of 1 to 4, wherein when N is an integer of 2 or larger, N structural formulas within the parentheses [ ] are the same or different; and each r is independently an integer of 0 to 2.

  本发明采用了下式 (0) 所代表的化合物： 其中 RY 是 1 至 30 个碳原子的直链、支链或环状烷基或 6 至 30 个碳原子的芳基； RZ 是 1 至 60 个碳原子的 N 价基团或单键； 每个 RT 独立地是 1 至 30 个碳原子的烷基，可选择具有取代基；6 至 40 个碳原子的芳基，可选择具有取代基；2 至 30 个碳原子的烯基，可选择具有取代基；1 至 30 个碳原子的烷氧基，可选择具有取代基；卤素原子；硝基；氨基；氰基；硫醇基、羟基或羟基的氢原子被酸离解基团取代的基团，其中烷基、烯基和芳基各自可选含有醚键、酮键或酯键，其中至少一个 RT 是羟基或羟基的氢原子被酸离解基团取代的基团； X 是氧原子、硫原子或不是交联剂；每个 m 独立地为 0 至 9 的整数，其中至少一个 m 为 1 至 9 的整数； N 是 1 至 4 的整数，其中当 N 是 2 或更大的整数时，括号[ ]内的 N 结构式相同或不同；以及 每个 r 独立地为 0 至 2 的整数。