The invention provides a chip comprising a substrate with at least one surface and a layer of particles having a non-metallic core and a coating made of a transition metal or a transition metal alloy, characterized in that each non-metallic core, on average, forms a metal-surrounded contact point with at least one other non-metallic core and/or the substrate surface.
The invention also provides a method for preparing a chip, comprising the steps of,
adsorbing non-metallic particles on said surface of the substrate, and, subsequently,
adsorbing colloids of a transition metal on said non-metallic particles to provide the shell made of a transition metal or a transition metal alloy, and a chip which is obtainable by said method.
The chip can be employed in optical devices for the detection of analytes.
本发明提供了一种芯片,包括至少有一个表面的基底和一层具有非
金属芯的颗粒,以及由过渡
金属或过渡
金属合
金制成的涂层,其特征在于每个非
金属芯平均与至少另一个非
金属芯和/或基底表面形成一个
金属包围的接触点。
本发明还提供了一种制备芯片的方法,包括以下步骤、
在所述衬底表面吸附非
金属颗粒,然后
在所述非
金属颗粒上吸附过渡
金属胶体,以提供由过渡
金属或过渡
金属合
金制成的外壳,以及通过所述方法获得的芯片。
该芯片可用于检测分析物的光学设备中。