COMPOSITION FOR FORMING HEAT CONDUCTIVE MATERIALS, HEAT CONDUCTIVE MATERIAL, HEAT CONDUCTIVE SHEET, DEVICE WITH HEAT CONDUCTIVE LAYER, AND FILM
申请人:FUJIFILM Corporation
公开号:EP3858885A1
公开(公告)日:2021-08-04
The present invention provides a thermally conductive material-forming composition from which a thermally conductive material having excellent thermally conductive properties can be obtained. Moreover, a thermally conductive material formed of the thermally conductive material-forming composition, a thermally conductive sheet, and a device with a thermally conductive layer are provided. Further, the present invention provides a film from which a thermally conductive sheet having excellent thermally conductive properties can be prepared. Furthermore, a thermally conductive sheet prepared using the film, and a device with a thermally conductive layer are provided. The thermally conductive material-forming composition according to the embodiment of the present invention is a thermally conductive material-forming composition including an epoxy compound, one or more kinds of phenolic compounds selected from the group consisting of a compound represented by General Formula (1) and a compound represented by General Formula (2), and an inorganic substance, or the like.
本发明提供了一种导热材料成型组合物,通过该组合物可以获得具有优异导热性能的导热材料。此外,本发明还提供了由该导热材料形成组合物形成的导热材料、导热片材以及具有导热层的设备。此外,本发明还提供了一种薄膜,通过该薄膜可制备出具有优异导热性能的导热片材。此外,本发明还提供了一种使用该薄膜制备的导热片材,以及一种具有导热层的设备。根据本发明实施例的导热材料形成组合物是一种导热材料形成组合物,包括环氧化合物、一种或多种酚类化合物,这些酚类化合物选自由通式(1)表示的化合物和通式(2)表示的化合物以及无机物或类似物组成的组。