A highly dielectric addition type curable composition is provided comprising (A) an organopolysiloxane containing a cyanoalkyl group and a monovalent hydrocarbon group having an aliphatic unsaturated bond, (B) an organohydrogenpolysiloxane containing a cyanoalkyl group, and (C) a platinum group metal catalyst. The composition is easy to handle because of liquid despite solvent-free, less hygroscopic and effectively curable, and has a film-forming ability. The cured composition has excellent dielectric properties as demonstrated by a large dielectric constant and a low dielectric loss.
本发明提供了一种高介电加成型可固化组合物,该组合物由 (A) 含
氰基烷基和具有脂肪族不饱和键的单价烃基的有机聚
硅氧烷、(B) 含
氰基烷基的有机氢聚
硅氧烷和 (C)
铂族
金属催化剂组成。该组合物尽管不含溶剂,但呈液态,易于处理,吸湿性较低,可有效固化,并具有成膜能力。固化后的组合物介电常数大、介电损耗低,具有极佳的介电性能。