diverse metals, and a family of isostructural tailored materials (UiO-66-alkyne-Co, UiO-66-(alkyne-Co)2 and UiO-66-(alkyne-Ni)2) with base metals Ni or Co were designed and synthesized successfully. Among them, di-alkyne tagged UiO-66-(alkyne-Co)2 has shown unprecedented remarkable performance as a heterogeneous catalyst for the Knoevenagel reaction, completely converting benzaldehyde in just 5 min at
Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device
申请人:——
公开号:US20020013443A1
公开(公告)日:2002-01-31
A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film.
The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.
Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same
申请人:——
公开号:US20040002572A1
公开(公告)日:2004-01-01
A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.
Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device
申请人:Enoki Takashi
公开号:US20080206548A1
公开(公告)日:2008-08-28
A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.
Resin Composition, Varnish, Resin Film and Semiconductor Device
申请人:Enoki Takashi
公开号:US20090214860A1
公开(公告)日:2009-08-27
Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.