2-allyl-4-methylimidazole

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 2-allyl-4-methylimidazole
• 英文别名: 5-methyl-2-prop-2-enyl-1H-imidazole
• 化学式: C₇H₁₀N₂
• 分子量: 122.17
• InChiKey: ZZPKIEOTWUDQIP-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.6
• 重原子数：
  9
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.29
• 拓扑面积：
  28.7
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为产物：
  描述：

  2-allyl-1,3-bis<(1-chloroethoxy)carbonyl>-4-methyl-4-imidazoline 在 氢氧化钾 、 potassium hexacyanoferrate(III) 作用下， 以 1,4-二氧六环 为溶剂， 反应 1.0h， 以57%的产率得到2-allyl-4-methylimidazole
  参考文献：
  名称：

  Allylation of azoles with allyltributyltin via unstable N-(alkoxycarbonyl)azolium salts

  摘要：

  The one-pot reactions of imidazoles with allyltributyltin in the presence of alkyl chloroformates gave 2-allyl-1,3-bis(alkoxycarbonyl)-4-imidazolines in good yields. The reactions of thiazoles and oxazoles also proceeded in a similar manner. The instability of the intermediary quaternary salts required the nucleophiles to be added simultaneously with the chloroformate. Therefore, the reaction was specific for allyltributyltin, since it doesn't react with the carbonyl group of chloroformates. The dihydro allyl adducts thus obtained were aromatized with potassium ferricyanide under basic conditions to afford the corresponding 2-allylazoles.

  DOI：

  10.1021/jo00085a020

文献信息

• ADHESIVE SHEET FOR SEMICONDUCTOR CONNECTING SUBSTRATE, ADHESIVE-BACKED TAPE FOR TAB, ADHESIVE-BACKED TAPE FOR WIRE-BONDING CONNECTION, SEMICONDUCTOR CONNECTING SUBSTRATE, AND SEMICONDUCTOR DEVICE
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP0823729A1

  公开（公告）日：1998-02-11

  An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110°C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130°C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170°C after having been cured, a storage elastic modulus E of 20 to 100 MPa at 150°C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130°C and 85% RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

  一种用于半导体连接基板的粘合片，包括在基板上具有粘合层的层压板，其中所述粘合层包含热塑性树脂(A)和环氧树脂(B)，并且所述环氧树脂(B)包含至少一种选自(I)含双环戊二烯骨架环氧树脂、(II)含萜烯骨架环氧树脂、(III)含联苯骨架环氧树脂和(IV)含萘骨架环氧树脂的环氧树脂(B)作为基本成分；一种用于 TAB 的背胶胶带，由在柔性有机绝缘薄膜上具有粘合剂层和保护膜层的层压板组成，其中所述粘合剂层在固化后的软化温度为 60 至 110°C，在 130°C 和 85% 相对湿度的环境中放置 50 小时或更长时间后，绝缘电阻下降时间为直流 100 V；一种用于导线粘合连接的带粘合剂的胶带，包括在柔性有机绝缘薄膜上具有粘合剂层和保护膜层的层压板，其中所述粘合剂层在固化后的软化温度为 120 至 170°C，在 150°C 时的存储弹性模量 E 为 20 至 100 兆帕，在 130°C 和 85% 相对湿度的环境中放置 50 小时或更长时间并施加直流 100 伏电压后的绝缘电阻下降时间。本发明的半导体连接基板用粘合片、TAB用背胶胶带和导线键合连接用背胶胶带在粘合强度、绝缘性、尺寸精度等方面都非常出色，可分别提高用于高密度封装的半导体集成电路连接基板和半导体器件的可靠性。
• Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1273630A1

  公开（公告）日：2003-01-08

  A resin composition has a phase separation structure having at least two phases and inorganic particles having a mean primary particle size of 0.1 µm or less. The phase separation structure includes a matrix phase and a disperse phase. The inorganic particles are mainly present in any one of the matrix phase, the disperse phase, and the interface between the matrix phase and the disperse phase. The resin composition has a high thermal expansion coefficient and elastic modulus, and thus provides an adhesive for semiconductor devices which has excellent reflow resistance and adhesion.

  一种树脂组合物具有相分离结构，其中至少有两相和平均主粒径为 0.1 微米或更小的无机颗粒。相分离结构包括基质相和分散相。无机颗粒主要存在于基体相、分散相以及基体相和分散相之间的界面中。该树脂组合物具有较高的热膨胀系数和弹性模量，因此可为半导体器件提供一种具有优异耐回流性和粘附性的粘合剂。
• SOLUBLE POLYIMIDE AND COMPOSITION COMPRISING THE SAME, BONDING SHEET, ADHESIVE LAMINATED FILM FOR COVERING ACCELERATOR BEAM TUBE, AND ADHESIVE LAMINATED FILM FOR COVERING CONDUCTOR WIRE FOR ACCELERATOR QUENCH HEATER
  申请人：Kaneka Corporation

  公开号：EP1281727A1

  公开（公告）日：2003-02-05

  An object of the present invention relates to a soluble polyimide having an excellent heat resistance and low water absorption, a composition containing the soluble polyimide, which is cured at a relatively low temperature and has excellent heat resistance and adhesive properties, a bonding sheet using the composition, and adhesive laminated film for covering an accelerator beam tube and for covering a conductor wire for an accelerator quench heater, which have excellent workability, flexibility, and radiation resistance at a low temperature and especially have excellent adhesive properties. The polyimide is obtained by reacting an acid dianhydride represented by the general formula (1) (wherein X represents a bivalent organic group having -(CH2)k- or an aromatic group and k is an integer of 1 to 10) with a compound represented by the general formula (2) (wherein A represents -NH2- or -NCO, Y independently represents -C(=O)-, -SO2-, -O-, -S-, -(CH2)m-, -NHCO-, -C(CH3)2-, -C(CF3)2-, -C(=O)O- or a single bond, and m and n each are an integer of 0 to 10). The polyimide has a solubility of 10% or higher at 20°C even in a low-boiling organic solvent, and has a glass transition temperature of 100°C to 250°C and water absorption of 1.5% or lower. Specially, by mixing with epoxy resin, the soluble polyimide is used as a composition, solution of polyimide adhesive, laminator, bonding sheet, and adhesive laminated films suitable for covering an accelerator beam tube or for covering a conductor wire for an accelerator quench heater.

  本发明的目的涉及一种具有优异耐热性和低吸水性的可溶性聚酰亚胺；一种含有该可溶性聚酰亚胺的组合物，该组合物在相对较低的温度下固化，具有优异的耐热性和粘合性；一种使用该组合物的粘合片；以及用于覆盖加速器束管和覆盖加速器淬火加热器导线的粘合层压膜，该粘合层压膜在低温下具有优异的可加工性、柔韧性和抗辐射性，尤其是具有优异的粘合性。这种聚酰亚胺是由通式（1）代表的酸酐反应得到的 (其中 X 代表具有-(CH2)k-或芳香族基团的二价有机基团，k 为 1 至 10 的整数）与通式（2）所代表的化合物反应而得 (其中 A 代表-NH2-或-NCO，Y 独立地代表-C(＝O)-、-SO2-、-O-、-S-、-(CH2)m-、-NHCO-、-C(CH3)2-、-C(CF3)2-、-C(＝O)O-或单键，且 m 和 n 均为 0 至 10 的整数)。即使在低沸点有机溶剂中，聚酰亚胺在 20°C 时的溶解度也在 10% 或以上，玻璃化温度为 100°C 至 250°C，吸水率为 1.5% 或更低。特别是，通过与环氧树脂混合，可溶性聚酰亚胺可用作组合物、聚酰亚胺粘合剂溶液、层压剂、粘合片和粘合层压膜，适用于覆盖加速器束管或覆盖加速器淬火加热器的导线。
• Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate, and semiconductor device
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1447843A2

  公开（公告）日：2004-08-18

  An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110°C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130°C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170°C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150°C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130°C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

  一种用于半导体连接基板的粘合片，包括在基板上具有粘合层的层压板，其中所述粘合层包含热塑性树脂(A)和环氧树脂(B)，并且所述环氧树脂(B)包含至少一种选自(I)含双环戊二烯骨架环氧树脂、(II)含萜烯骨架环氧树脂、(III)含联苯骨架环氧树脂和(IV)含萘骨架环氧树脂的环氧树脂(B)作为基本成分；一种用于 TAB 的背胶胶带，由在柔性有机绝缘薄膜上具有粘合剂层和保护膜层的层压板组成，其中所述粘合剂层在固化后的软化温度为 60 至 110°C，在 130°C 和 85% 相对湿度的环境中放置 50 小时或更长时间后，绝缘电阻下降时间为直流 100 V；一种用于导线粘合连接的带粘合剂的胶带，由在柔性有机绝缘薄膜上具有粘合剂层和保护膜层的层压板组成，其中所述粘合剂层在固化后的软化温度为 120 至 170°C，在 150°C 时的存储弹性模量 E' 为 20 至 100 兆帕，在 130°C 和 85 % 相对湿度的环境中放置 50 小时或更长时间并施加直流 100 V 后绝缘电阻下降。本发明的半导体连接基板用胶片、TAB 用背胶胶带和导线键合连接用背胶胶带在粘合强度、绝缘性、尺寸精度等方面都非常出色，可分别提高用于高密度封装的半导体集成电路连接基板和半导体器件的可靠性。
• ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND COVER LAY FILM, ADHESIVE SHEET, AND COPPER-CLAD POLYIMIDE FILM EACH MADE WITH THE SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1640428A1

  公开（公告）日：2006-03-29

  An adhesive composition for semiconductor devices which comprises an epoxy resin, a phenoxy resin, and a hardener, wherein part or all of the epoxy resin comprises at least one type of epoxy resin selected from the followings: (a) a dimer acid modified epoxy resin (b) a phosphorus containing epoxy resin having an epoxy equivalent of 2000 to 6000. Said adhesive composition has satisfactory flexural properties even in a high-temperature environment while retaining an excellent toughness of the adhesive and is excellent in soldering heat resistance, adhesive property, flame retardancy and electrical properties. The adhesive composition can suitable be used for cover lay films, adhesive sheets and copper-clad polyimide films.

  一种用于半导体器件的粘合剂组合物，它由环氧树脂、苯氧树脂和固化剂组成，其中部分或全部环氧树脂由至少一种选自以下的环氧树脂组成： (a) 二聚酸改性环氧树脂 (b) 环氧当量为 2000 至 6000 的含磷环氧树脂。 所述粘合剂组合物即使在高温环境下也具有令人满意的挠曲性能，同时还能保持粘合剂的出色韧性，并具有出色的耐焊接热性、粘合性、阻燃性和电气性能。该粘合剂组合物适合用于覆盖层薄膜、粘合片和覆铜聚酰亚胺薄膜。