1,1’-(2,2,4-三甲基-1,6-己二基)双-1H-吡咯-2,5-二酮 | 39979-46-9

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯烷类
• 中文名称: 1,1’-(2,2,4-三甲基-1,6-己二基)双-1H-吡咯-2,5-二酮
• 中文别名: 1,1'-(2,2,4-三甲基-1,6-己二基)双-1H-吡咯-2,5-二酮
• 英文名称: 1,6-Bis-maleinimido-(2,2,4-trimethyl)-hexan
• 英文别名: 1,1'-(2,2,4-trimethylhexane-1,6-diyl)bis-1H-pyrrole-2,5-dione；1H-Pyrrole-2,5-dione, 1,1'-(2,2,4-trimethyl-1,6-hexanediyl)bis-；1-[6-(2,5-dioxopyrrol-1-yl)-3,5,5-trimethylhexyl]pyrrole-2,5-dione
• CAS: 39979-46-9
• 化学式: C₁₇H₂₂N₂O₄
• 分子量: 318.373
• InChiKey: XQCDLHVXAXBMGW-UHFFFAOYSA-N

物化性质

• 沸点：
  476.5±28.0 °C(Predicted)
• 密度：
  1.216±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.4
• 重原子数：
  23
• 可旋转键数：
  7
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.53
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  3-氨基苯酰肼 、 乳酸盐 、 双马来酰亚胺 、 N,N-(4-甲基-1,3-亚苯基)双马来酰亚胺 、 1,1’-(2,2,4-三甲基-1,6-己二基)双-1H-吡咯-2,5-二酮 以to give a molten BMI resin to which 66 parts of the product of Example 12的产率得到4-[2-(1-propen-1-yl)phenoxy]benzophenone
  参考文献：
  名称：

  Curable resin from bis-maleimide and alkenyl phenyl hydroxy ether

  摘要：

  高断裂韧性的固化树脂可以由公式I N,N'-双亚甲基化合物和公式II D(G).sub.m II的烯基化合物制备，其中D是一个m价基团，G代表至少具有一个烯基（例如烯丙基或1-丙烯基）取代基的苯环。

  公开号：

  US04871821A1

文献信息

• COMPOSITION FOR FORMING OPTICAL COMPONENT, OPTICAL COMPONENT, COMPOUND, AND RESIN
  申请人：Mitsubishi Gas Chemical Company, Inc.

  公开号：US20210309595A1

  公开（公告）日：2021-10-07

  Provided is a composition containing a polyphenol compound (B) and a solvent, in which the polyphenol compound (B) is at least one selected from a compound represented by the following formula (1) and a resin having a structure represented by the following formula (2): wherein R Y , R T , X, m, N, r, and L are as described in the description.

  提供的是含有多酚化合物(B)和溶剂的组合物，其中多酚化合物(B)至少选自以下式子(1)所表示的化合物和以下式子(2)所表示的具有结构的树脂之一：其中RY、RT、X、m、N、r和L如说明书中所述。
• [EN] POLY(ALLYL ETHER)S OF POLYCYCLOPENTADIENE POLYPHENOL<br/>[FR] POLY(ALLYL ÉTHERS) DE POLYCYCLOPENTADIÈNE POLYPHÉNOL
  申请人：DOW GLOBAL TECHNOLOGIES LLC

  公开号：WO2011136847A1

  公开（公告）日：2011-11-03

  Embodiments include poly(allyl ether)s of polycyclopentadiene polyphenol that can be obtained by allylation of a polycyclopentadiene polyphenol, where the aromatic hydroxyl group(s) (-OH) are converted to HR1C=CR1-CH2-0- and/or H2R1C-CR1=HC-0-, where R1 is as described herein. Embodiments also include thermosettable compositions including the poly(allyl ether)s of polycyclopentadiene polyphenol and products obtained by curing the thermosettable compositions.

  实施例包括聚环戊二烯多酚的聚烯丙醚，其可通过多环戊二烯多酚的烯丙基化获得，其中芳香羟基(-OH)被转化为HR1C=CR1-CH2-0-和/或H2R1C-CR1=HC-0-，其中R1如本文所述。实施例还包括包括聚环戊二烯多酚聚烯丙醚的热固性组合物和通过固化热固性组合物获得的产品。
• [EN] VINYLBENZYL ETHERS OF POLYCYCLOPENTADIENE POLYPHENOL<br/>[FR] VINYLBENZYL ÉTHERS DE POLYCYCLOPENTADIÈNE POLYPHÉNOL
  申请人：DOW GLOBAL TECHNOLOGIES LLC

  公开号：WO2011136845A1

  公开（公告）日：2011-11-03

  Embodiments include vinylbenzyl ethers of polycyclopentadiene polyphenol that can be obtained by reacting a polycyclopentadiene polyphenol with a vinylbenzyl halide. Embodiments also include thermosettable compositions including the vinylbenzyl ethers of a polycyclopentadiene polyphenol and products obtained by curing the thermosettable compositions. Formula (I).

  实施例包括通过将多环戊二烯多酚与乙烯基苯基卤化物反应得到的多环戊二烯多酚乙烯基醚。实施例还包括包括多环戊二烯多酚乙烯基醚的热固性组合物和通过固化热固性组合物获得的产品。公式（I）。
• Curable resin from bis-maleimide and alkenyl phenyl hydroxy ether
  申请人：Technochemie GmbH

  公开号：US04871821A1

  公开（公告）日：1989-10-03

  Cured resins of high fracture toughness are prepared from N,N'-bisimides of formula I ##STR1## and alkenyl compounds of formula II D(G).sub.m II in which D is an m-valent group and G represents a phenyl ring having at least one alkenyl (e.g. allyl or 1-propenyl) substituent.

  高断裂韧性的固化树脂可以由公式I N,N'-双亚甲基化合物和公式II D(G).sub.m II的烯基化合物制备，其中D是一个m价基团，G代表至少具有一个烯基（例如烯丙基或1-丙烯基）取代基的苯环。
• LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF
  申请人：Dershem Stephen M.

  公开号：US20100063184A1

  公开（公告）日：2010-03-11

  The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.

  本发明基于发现，某些电子贫乏的烯烃与亲核试剂和碱催化剂结合后，可用作电子封装行业的粘合剂组合物。特别地，本发明中所述的粘合剂配方可用作低温固化配方，对各种基底具有高粘附力。发明配方通常在约80°C下固化，并具有约24小时的搅拌寿命。该配方通过众所周知的Michael加成反应固化。