1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮的化合物 | 68490-66-4

• 物质功能分类: 有机原料 - 酮类化合物
• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 中文名称: 1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮的化合物
• 中文别名: 6-[2-(2-甲基-1H-咪唑-1-基)乙基]-1,3,5-三嗪-2,4-二胺
• 英文名称: 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5-triazine isocyanuric acid
• 英文别名: 6-[2-(2-methylimidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine;1,3,5-triazinane-2,4,6-trione
• CAS: 68490-66-4
• 化学式: C₃H₃N₃O₃*C₉H₁₃N₇
• 分子量: 348.324
• InChiKey: CFSJAORJCPGPFP-UHFFFAOYSA-N

物化性质

• 密度：
  1.427 at 20℃
• LogP：
  0.3 at 30℃ and pH4-10

计算性质

• 辛醇/水分配系数(LogP)：
  -2.46
• 重原子数：
  25
• 可旋转键数：
  3
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  196
• 氢给体数：
  5
• 氢受体数：
  9

反应信息

• 作为反应物：
  描述：

  1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮的化合物 生成 2-甲基咪唑
  参考文献：
  名称：

  摘要：

  DOI：
• 作为产物：
  描述：

  氰尿酸 、 2,4-二氨基-6-[2-(2-甲基-1-咪唑基)乙基]-1,3,5-噻嗪 以 乙醇 为溶剂， 反应 5.0h， 以92%的产率得到1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮的化合物
  参考文献：
  名称：

  一种咪唑三嗪异氰尿酸潜伏性固化剂及其合成方法和应用

  摘要：

  本发明提供了一种新型咪唑三嗪异氰尿酸潜伏性固化剂及其合成方法和应用，其中咪唑三嗪异氰尿酸潜伏性固化剂是以2,4‑二氨基‑6‑[2‑(2‑苯基‑1‑咪唑)乙基]‑1,3,5‑三嗪或其它咪唑衍生物和三聚氰酸为原料，在绿色质子性溶剂中，一步法、简单高效的合成了咪唑三嗪异氰尿酸潜伏性固化剂。本发明反应条件温和、操作简单、原子经济性高，无三废排放，经济效益高，且该工艺已在车间试生产，实现了工业化。同时，该产品稳定性好，室温下潜伏周期长，并且与氰胺和咪唑固化剂相比，固化时间快，与环氧树脂发生交联固化后具有良好的力学性能，其次耐水性强、阻燃效果好。

  公开号：

  CN114409639A

文献信息

• Process for synthesis of 2-vinyl-4,6-diamino-S-triazine
  申请人：SHIKOKU CHEMICALS CORPORATION

  公开号：EP0188039A1

  公开（公告）日：1986-07-23

  Disclosed is a process for the synthesis of 2-vinyt-4, 6-diamino-S-triazine having the following structural formula: which comprises heating an imidazolyl-S-triazine compound represented by the following general formula: wherein R1 stands for a hydrogen atom, a methyl group or an ethyl group, and R2 stands for a hydrogen atom or a methyl group, or an isocyanuric acid-addition product thereof under reduced pressure in the presence of a polymerization inhibitor. According to this process, 2-vinyl-4,6-diamino-S--triazine can be manufactured at a low cost on an industiral scale.

  本发明公开了一种具有以下结构式的 2-乙烯基-4,6-二氨基-S-三嗪的合成工艺：该工艺包括在聚合抑制剂存在下，在减压条件下加热由以下通式表示的咪唑基-S-三嗪化合物：其中 R1 代表氢原子、甲基或乙基，R2 代表氢原子或甲基，或其异氰酸加成产物。 根据该工艺，可以在工业规模上以低成本生产 2-乙烯基-4,6-二氨基-S-三嗪。
• Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same
  申请人：Ajinomoto Co., Inc.

  公开号：EP0851726A2

  公开（公告）日：1998-07-01

  An inter-laminar adhesive film is provided for multi-layer printed wiring boards, the film being attached to an internal-layer circuit board where the film is embedded in an internal-layer circuit. A process of producing a multi-layer printed wiring board using the film is also provided. The adhesive film facilitates simultaneous and integral coating of an internal-layer circuit pattern and resin filling into through-holes and/or superficial via holes in a build-up process of producing a multi-layer printed wiring board in which a conductor circuit layer and an insulation layer are alternately laminated together. The adhesive film for multi-layer printed wiring boards, comprises a support film base and a resin composition which is solid at ambient temperature, both to be laminated on an internal-layer circuit board, wherein the resin composition which is solid at ambient temperature contains at least 10% by weight of a resin with a lower softening point than the lamination thickness of the conductor in the internal-layer circuit and the resin flow of the resin composition at the lamination temperature is at least of the thickness of the conductor of the internal-layer circuit, or is of the depth of a superficial via hole if present in the internal-layer circuit, or is 1/2 fold or more the depth of a through-hole in the internal-layer circuit singly or in combination with a superficial via hole.

  提供了一种用于多层印刷线路板的层间粘合薄膜，该薄膜附着在内层电路板上，薄膜嵌入内层电路中。此外，还提供了一种使用该薄膜生产多层印刷线路板的工艺。 在生产导体电路层和绝缘层交替层压在一起的多层印刷电路板的堆积过程中，该胶膜有助于同时整体涂覆内层电路图案，并将树脂填充到通孔和/或表面通孔中。 用于多层印刷线路板的粘合膜包括支撑膜基和在环境温度下为固态的树脂组合物，两者都要层压在内层线路板上，其中在环境温度下为固态的树脂组合物含有至少 10%（按重量计）的树脂，其软化点低于内层线路中导体的层压厚度，树脂组合物在层压温度下的树脂流动至少为内层线路中导体的厚度、或相当于表层通孔的深度（如果内层电路中存在表层通孔），或相当于内层电路中单独或与表层通孔组合的通孔深度的 1/2 倍或以上。
• ADHESIVE FILM AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD COMPRISING THE SAME
  申请人：Ajinomoto Co., Inc.

  公开号：EP1307077A1

  公开（公告）日：2003-05-02

  In this application is disclosed an adhesive film for a multilayer printed wiring board which comprises at least the following Layer A and Layer B in the adjacent position, wherein the thermosetting resin composition constituting the Layer B is a thermosetting resin composition which contains a resin having a lower softening point than the lamination temperature concerned in an amount of not smaller than 10% by weight, and can fill with itself (or resin-fill) the through holes and/or via holes concurrently with being laminated onto a circuit board; Layer A: A heat-resistant resin layer comprising at least one heat-resistant resin selected from the group consisting of a polyimide, a liquid crystal polymer, an aramid resin and a polyphenylene sulfide and having a thickness of 2 to 30 µm, Layer B: A thermosetting resin composition layer which contains an epoxy resin having at least two epoxy groups in one molecule (Component (a)) and an epoxy curing agent (Component (b)) and is solid at ordinary temperature, with the use of which adhesive film can allows an easy introduction of an insulating layer having excellent mechanical strength at the time of producing a multilayer printed wiring board by a build-up technique, and a multilayer printed wiring board having excellent mechanical strength can, in turn, be provided.

  本申请公开了一种用于多层印刷线路板的粘合膜，它至少包括以下层 A 和相邻位置的层 B，其中构成层 B 的热固性树脂组合物是一种热固性树脂组合物，它含有一种软化点低于相关层压温度的树脂，其含量不小于 10%（按重量计），并且在层压到线路板上的同时可以用自身填充（或树脂填充）通孔和/或通孔； 层 A：耐热树脂层，包括至少一种耐热树脂，选自聚酰亚胺、液晶聚合物、芳纶树脂和聚苯硫醚，厚度为 2 至 30 微米、 层 B：热固性树脂成分层，它包含在一个分子中至少有两个环氧基团的环氧树脂（成分 (a)）和环氧固化剂（成分 (b)），在常温下为固态，使用这种粘合膜可以在通过堆积技术生产多层印刷电路板时轻松引入具有优异机械强度的绝缘层，进而提供具有优异机械强度的多层印刷电路板。
• Process for producing a multi-layer printer wiring board
  申请人：——

  公开号：US20020076539A1

  公开（公告）日：2002-06-20

  The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition. This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive.

  本发明涉及一种层间粘合剂组合物，该组合物含有液态环氧树脂、软化点高于粘合剂层压温度且分子中含有两个或两个以上环氧基团的多官能环氧树脂；以及在高于层压温度下引发反应的潜伏环氧固化剂。粘合剂组合物可选择含有除液态环氧树脂和/或有机溶剂之外的液态树脂，液态树脂包括液态环氧树脂、有机溶剂或两者，占组合物重量的 10%至 55%。 这种层间粘合剂组合物可用于制备多层印刷线路板。提供了制备多层印刷线路板的工艺。本发明制备的多层印刷线路板在内层电路中具有极佳的嵌入性能，表面平滑度极佳，并可在使用本粘合剂的堆积工艺中以高生产率提供。
• ——
  作者：CABA NATSUO、 MASUDA TAKEHSI

  DOI：——

  日期：——