5-(2,4-dimethoxyphenyl)-3-[(E)-2-(2,4-dimethoxyphenyl)ethenyl]-1-phenyl-4,5-dihydro-1H-pyrazole

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 5-(2,4-dimethoxyphenyl)-3-[(E)-2-(2,4-dimethoxyphenyl)ethenyl]-1-phenyl-4,5-dihydro-1H-pyrazole
• 英文别名: 3-(2,4-dimethoxyphenyl)-5-[(E)-2-(2,4-dimethoxyphenyl)ethenyl]-2-phenyl-3,4-dihydropyrazole
• 化学式: C₂₇H₂₈N₂O₄
• 分子量: 444.5
• InChiKey: UUKTXSKHUSFFPV-ZRDIBKRKSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.3
• 重原子数：
  33
• 可旋转键数：
  8
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.22
• 拓扑面积：
  52.5
• 氢给体数：
  0
• 氢受体数：
  6

文献信息

• Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Printed Wiring Board
  申请人：Miyasaka Masahiro

  公开号：US20090029289A1

  公开（公告）日：2009-01-29

  A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C 1-10 alkoxy group or a C 1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
• PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD
  申请人：MIYASAKA Masahiro

  公开号：US20100279229A1

  公开（公告）日：2010-11-04

  A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C 1-10 alkoxy group or a C 1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
• PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US20150293443A1

  公开（公告）日：2015-10-15

  The invention provides a photosensitive resin that includes: a binder polymer that has a structural unit derived from (meth)acrylic acid, a structural unit derived from styrene or α-methyl styrene, and a structural unit derived from benzyl (meth)acrylate; a photopolymerizable compound including a first bisphenol di(meth)acrylate that has an ethyleneoxy group and a propyleneoxy group, in which a number of structural units of the ethyleneoxy group is from 1 to 20 and a number of structural units of the propyleneoxy group is from 2 to 7, and in which a total number of structural units of the ethyleneoxy group and the propyleneoxy group is more than 10; and a photopolymerization initiator.
• US7993809B2
  申请人：——

  公开号：US7993809B2

  公开（公告）日：2011-08-09
• US8198008B2
  申请人：——

  公开号：US8198008B2

  公开（公告）日：2012-06-12