1-氰基乙基-2-甲基咪唑 | 23996-57-8

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 中文名称: 1-氰基乙基-2-甲基咪唑
• 英文名称: 1-(γ-Cyanethyl)-2-ethyl-imidazol
• 英文别名: 3-(2-ethyl-imidazol-1-yl)-propionitrile；3-(2-ethyl-1H-imidazol-1-yl)propanenitrile；3-(2-ethylimidazol-1-yl)propanenitrile
• CAS: 23996-57-8；568591-00-4
• 化学式: C₈H₁₁N₃
• mdl: MFCD12026944
• 分子量: 149.195
• InChiKey: QISPCYXLKLRPAE-UHFFFAOYSA-N

物化性质

• 熔点：
  39-40 °C
• 沸点：
  341.5±25.0 °C(Predicted)
• 密度：
  1.03±0.1 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  0.5
• 重原子数：
  11
• 可旋转键数：
  3
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  41.6
• 氢给体数：
  0
• 氢受体数：
  2

安全信息

• 海关编码：
  2933290090

文献信息

• Resin composition, prepreg and laminate using the same
  申请人：Nishimura Yoshimasa

  公开号：US20090110938A1

  公开（公告）日：2009-04-30

  A cyanate ester resin composition for a printed wiring board material containing a cyanate ester resin component A comprising a cyanate ester compound represented by the formula (1) and/or an oligomer thereof, and at least one component B selected from the group consisting of an epoxy resin and a maleimide compound, which resin composition is improved in heat resistance and heat resistance after moisture absorption, is excellent in mechanical properties such as elastic modulus and has flame retardancy without a halogen compound, and a prepreg and a laminate each of which uses the resin composition defined as above wherein the resin composition contains the component A and at least the epoxy resin as the component B.

  一种氰酸酯树脂组合物，用于印制线路板材料，包含氰酸酯树脂组分A，该组分A包括由式（1）表示的氰酸酯化合物和/或其寡聚物，并且至少包括从环氧树脂和马来酰亚胺化合物组成的群中选择的一种组分B。该树脂组合物在耐热性和吸湿后的耐热性方面得到改善，具有弹性模量等机械性能优异，并且具有无卤化合物的阻燃性。其中，预浸料和层压板各自使用定义如上的树脂组合物，其中树脂组合物包含组分A和至少环氧树脂作为组分B。
• Thermosetting resin composition
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP0290860A2

  公开（公告）日：1988-11-17

  A thermosetting resin composition polyfunctional cyanate ester resin composition comprising: (I) a cyanate ester compound selected from the group consisting of a polyfunctional cyanate ester having at least two cyanate esters in its molecule, a prepolymer of such a cyanate ester and mixtures thereof; and (II) at least one non-branched aromatic compound in an amount of 5 - 40% by weight of the total resin composition, said aromatic compound having a number-average molecular weight of 178 - 800, an average number of aromatic nuclei of 2 - 6, and a boiling point of more than 300°C, and in which the portion having aromatic nuclei of 2 - 6 constitutes more than 50% is disclosed.

  一种热固性树脂组合物多官能团氰酸酯树脂组合物，包括 (I) 氰酸酯化合物，选自由其分子中至少含有两种氰酸酯的多官能团氰酸酯、氰酸酯预聚 物及其混合物组成的组；以及 (II) 至少一种非支链芳香族化合物，其用量占树脂组合物总量的 5-40%（按重量计），所述芳香族化合物的数均分子量为 178-800，芳香核的平均数目为 2-6，沸点超过 300°C，其中芳香核数目为 2-6 的部分占 50%以上。
• NOVEL RESIN, PROCESS FOR PREPARING THE SAME, AND COMPOSITION COMPRISING THE SAME
  申请人：NIPPON OIL CO. LTD.

  公开号：EP0458984A1

  公开（公告）日：1991-12-04

  A novel hydroxyphenylated resin having excellent thermal stability, weather resistance and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating material, etc.; a process for preparing the same; and a curable epoxy resin composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bond; a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as the starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

  一种新型羟苯基化树脂，具有优异的热稳定性、耐候性和电气性能，可用作印刷电路板用树脂、半导体密封用树脂、绝缘材料等；一种制备该树脂的工艺；以及一种包含该树脂的可固化环氧树脂组合物。具体地说，本发明提供了一种含有多个酚羟基、软化点高且基本上没有双键的新型树脂；一种制备该树脂的工艺，其中使用丁二烯低聚物和苯酚化合物作为起始材料；以及一种包含该树脂的可固化环氧树脂组合物，该组合物适用于密封材料等应用。
• URETHANE OLIGOMER, RESIN COMPOSITIONS THEREOF, AND CURED ARTICLE THEREOF
  申请人：Nippon Kayaku Kabushiki Kaisha

  公开号：EP1170315A1

  公开（公告）日：2002-01-09

  The present invention is intended to provide a resin and a resin composition that can be diluted with water and is excellent in providing a cured product (curing, adhesion, and water resistance); a resin composition that is suitable for a solder resist and an interlayer dielectric layer because the cured product is excellent in flexibility, soldering-heat resistance or the like and allows a development with an organic solvent or a dilute alkali solution; a photosensitive resin composition suitable for an etching resist or a cover lay; and a photosensitive film obtained thereby. A urethane oligomer (A) obtained by reacting a polyol compound(a) with a polybasic acid anhydride(b-1) having at least two acid anhydride groups per molecule, a polyisocyanate compound(c), and a hydroxy compound having ethylenically unsaturated groups; and A resin composition and a photosensitive film comprising (1) the above oligomer (A); (2) one or more resins selected from an unsaturated group-containing polycarboxylic acid (B), a reactive diluent(C-1)such as (meth)acrylates, an unreactive diluent(C-2)such as carbitol acetate and a thermoplastic polymer(D); and (3) a photopolymerization initiator.

  本发明的目的是提供一种树脂和树脂组合物，该树脂和树脂组合物可以用水稀释，并在提供固化产品（固化、粘合和耐水性）方面具有优异性能；一种树脂组合物，该树脂组合物适用于阻焊层和层间介电层，因为固化产品具有优异的柔韧性、耐焊热性或类似性能，并可以用有机溶剂或稀碱溶液显影；一种感光树脂组合物，该树脂组合物适用于蚀刻阻焊层或覆盖层；以及由此获得的感光薄膜。 一种聚氨酯低聚物 (A)，由多元醇化合物 (a) 与每分子至少有两个酸酐基团的多基酸酐 (b-1)、多异氰酸酯化合物 (c) 和具有乙烯不饱和基团的羟基化合物反应而得；以及 一种树脂组合物和感光胶片，包括(1)上述低聚物(A)；(2)一种或多种树脂，选自含不饱和基团的聚羧酸(B)、活性稀释剂(C-1)（如(甲基)丙烯酸酯）、非活性稀释剂(C-2)（如乙酸卡必酯）和热塑性聚合物(D)；以及(3)一种光聚合引发剂。
• REGENERATED COLLAGEN FIBER REDUCED IN ODOR AND IMPROVED IN SUITABILITY FOR SETTING, PROCESS FOR PRODUCING THE SAME, AND METHOD OF SETTING
  申请人：KANEKA CORPORATION

  公开号：EP1211347A1

  公开（公告）日：2002-06-05

  The present invention provides regenerated collagen fibers which have light color and excellent touch in wet conditions and which can be formed into desirable shape with the shape being maintained properly. The present invention also provides regenerated collagen fibers whose foul odor generated in thermal treatment can be inhibited. The present invention relates to regenerated collagen fibers obtained by treating collagen with a monofunctional epoxy compound and an aluminum salt. The present invention also relates to a process for preparing regenerated collagen fibers which comprises treating collagen with a monofunctional epoxy compound, and then treating the same in such a way that 2 to 40 % by weight of an aluminum salt converted to an aluminum oxide (Al2O3) basis is contained to said collagen.

  本发明提供的再生胶原纤维颜色浅，在潮湿条件下手感极佳，可形成理想的形状，并能保持适当的形状。本发明还提供了可抑制热处理中产生的恶臭的再生胶原纤维。 本发明涉及通过用单官能环氧化合物和铝盐处理胶原蛋白而获得的再生胶原纤维。 本发明还涉及一种制备再生胶原纤维的工艺，该工艺包括用单官能环氧化合物处理胶原蛋白，然后以这样一种方式处理胶原蛋白，即在所述胶原蛋白中含有 2%至 40%（按重量计）转化为氧化铝（Al2O3）的铝盐。