1-苄基-2-苯基咪唑盐酸盐 | 39269-68-6

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 中文名称: 1-苄基-2-苯基咪唑盐酸盐
• 英文名称: 1-Benzyl-2-phenylimidazole hydrochloride
• 英文别名: 1-benzyl-2-phenylimidazole;hydrochloride
• CAS: 39269-68-6
• 化学式: C16H15ClN2
• mdl: MFCD13190433
• 分子量: 270.75
• InChiKey: LIOJOGAWBPJICS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.83
• 重原子数：
  19
• 可旋转键数：
  3
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.062
• 拓扑面积：
  17.8
• 氢给体数：
  1
• 氢受体数：
  1

文献信息

• [EN] IMPROVEMENTS IN OR RELATING TO CURATIVES<br/>[FR] AMÉLIORATIONS APPORTÉES OU SE RAPPORTANT À DES AGENTS DE DURCISSEMENT
  申请人：HEXCEL COMPOSITES LTD

  公开号：WO2020216688A1

  公开（公告）日：2020-10-29

  The host compound in a clathrate is an amino or hydroxyl containing aromatic phosphorous compound, clathrates containing a resin curative and their use in curable resin compositions to produce moulded articles particularly fibre reinforced articles.

  在蛛网状化合物中的宿主化合物是一种含氨基或羟基的芳香磷化合物，这些蛛网状化合物含有树脂固化剂，可用于可固化树脂组合物中，以生产模塑制品，特别是纤维增强制品。
• INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
  申请人：Ono Kazuo

  公开号：US20100179250A1

  公开（公告）日：2010-07-15

  It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R 2 represents a hydrogen atom, etc.; R 3 to R 5 represent a hydrogen atom, etc.).

  这是为了改善密封剂的储存稳定性，保持密封时密封剂的流动性，并通过加热实现密封剂的有效固化速率，以适用于精细半导体的密封剂。它是一种用于密封半导体的环氧树脂组合物，包括以下组分（A）和组分（B）。（A）环氧树脂，（B）包括（b1）芳香羧酸化合物和（b2）至少一种由式（II）表示的咪唑化合物的笼形复合物（其中R2表示氢原子等；R3至R5表示氢原子等）。
• Adhesive tape for electronic parts and liquid adhesive
  申请人：TOMOEGAWA PAPER CO. LTD.

  公开号：EP0649892A1

  公开（公告）日：1995-04-26

  This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same. The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.

  本发明旨在提供一种可在相对较低温度下粘合和固化并具有足够耐热性和可靠性等优点的本发明液体粘合剂，以及使用该粘合剂的胶带。 本发明的液体粘合剂可通过溶解 (a) 含哌嗪基乙基氨基羰基的丁二烯-丙烯腈共聚物来获得，该共聚物的重量平均分子量为 10,000-200,000 ，丙烯腈含量为 5-50%（重量百分比），氨基当量为 500-10,000 ，由下式(I)表示： 其中，k、m 和 n 为摩尔比，取 n 为 1，k 为 3-175 的数值，m 为 0.3 至 93 的数值；以及 (b) 具有至少两个马来酰亚胺基团的化合物，组分(b)与 100 重量份组分(a)的比率为 10 至 900 重量份。将其涂在耐热薄膜的一个表面或两个表面上，或涂在离型膜的一个表面上，形成粘合层，从而获得用于电子零件的胶带。
• CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION
  申请人：NIPPON SODA CO., LTD.

  公开号：EP0949286A1

  公开（公告）日：1999-10-13

  The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula [I]; wherein X represents (CH2)n, wherein n is 0, 1, 2 or 3, and R1 to R8 each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula [I] shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.

  本发明的目的是提供环氧树脂用固化剂和环氧树脂用固化促进剂，它们都具有更好的升华和分解性能，当与环氧树脂混合时，能使混合物的热稳定性大大提高，这对控制固化反应极为重要，并能延长罐装寿命（作为由环氧树脂、固化剂等组成的一包混合物的稳定性）和改善低温下的固化性。 该固化剂的特点是由通式[I]代表的四联酚化合物组成的凝块； 其中 X 代表 (CH2)n，其中 n 为 0、1、2 或 3，R1 至 R8 各代表氢、低级烷基、任选取代的苯基、卤素或低级烷氧基，而固化促进剂的特征在于它是一种由上述通式[I]代表的四联双酚化合物和一种可加速固化的化合物组成的凝块，该化合物可与环氧树脂的环氧基团反应以固化该树脂。
• Curatives for epoxy resin, curing accelerator, and epoxy resin composition
  申请人：NIPPON SODA CO., LTD.

  公开号：EP1520867A2

  公开（公告）日：2005-04-06

  The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula [1]; wherein X represents (CH2)n, wherein n is 0, 1, 2 or 3, and R1 to R8 each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula [I] shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.

  本发明的目的是提供环氧树脂的固化剂和环氧树脂的固化促进剂，它们都具有更好的升华和分解性能，当与环氧树脂混合时，能使混合物的热稳定性大大提高，这对控制固化反应极为重要，并能延长罐装寿命（作为由环氧树脂、固化剂等组成的一包混合物的稳定性）和改善低温下的固化性。 该固化剂的特点是由通式[1]表示的四双酚化合物组成的凝块； 其中 X 代表(CH2)n，其中 n 是 0、1、2 或 3，R1 至 R8 各代表氢、低级烷基、任选取代的苯基、卤代物或低级烷氧基，固化促进剂的特征在于它是一种由上述通式[I]代表的四联双酚化合物和一种加速固化的化合物组成的凝块，该化合物与环氧树脂的环氧基团反应固化树脂。