苯乙烯 、 N-苯基马来酰亚胺 在
偶氮二异丁腈氮气 、 Mn 作用下,
以
甲苯 为溶剂,
反应 6.0h,
以Thus, 25.6 g of an ST-PM (90:10) random copolymer (Mn=43000) was obtained的产率得到1-苯基-1H-吡咯-2,5-二酮与乙烯基苯的聚合物(9CL)
COPOLYMERS AND COMPOSITIONS WITH ANTI-ADHESIVE AND ANTIMICROBIAL PROPERTIES
申请人:BASF SE
公开号:US20160235062A1
公开(公告)日:2016-08-18
The invention relates to a copolymer exhibiting both antimicrobial and anti-adhesive properties as well as to a hydrogel. Said hydrogel is obtained from the inventive copolymer and a substrate. Another part of the invention is a process for making the hydrogel, as well as different uses of the inventive copolymer as well as of the hydrogel.
Styrene copolymer and process for production thereof
申请人:Idemitsu Kosan Co., Ltd.
公开号:US05391671A1
公开(公告)日:1995-02-21
A styrene copolymer which comprises a styrene repeating unit (a) represented by the general formula (I): ##STR1## and an acrylonitrile repeating unit (b) represented by the general formula (II-(b)): ##STR2## unsaturated carboxylic acid or its ester repeating unit (c) represented by the general formula (II-(c)): ##STR3## or maleimide or N-substituted maleimide (d) represented by the general formula (II-(d)): ##STR4## (in the formula, symbols are the same as defined in the specification) wherein stereoregularity of the styrene repeating unit (a) chain is a high degree of syndiotactic configuration is disclosed.
A resin composite material including fine graphite particles including plate-like graphite particles, an aromatic vinyl copolymer which is adsorbed on the plate-like graphite particles and which has a vinyl aromatic monomer unit represented by the following formula: —(CH
2
—CHX)—(X represents a phenyl group, a naphthyl group, an anthracenyl group, or a pyrenyl group, provided that these groups may have substituents); a fibrous inorganic filler; and a resin matrix.
SOLUBLE CYCLIC IMIDES CONTAINING POLYMERS AS DIELECTRICS IN ORGANIC ELECTRONIC APPLICATIONS
申请人:BASF SE
公开号:US20160087230A1
公开(公告)日:2016-03-24
The present invention relates to an electronic device comprising a dielectric material, which dielectric material comprises a copolymer comprising styrene and maleimic acid and derivatives thereof as structural units, a process for the preparation of the electronic device and to the use of the copolymer as dielectric material, especially as dielectric layer in printed electronic devices such as capacitors and organic field-effect transistors.
A thermoplastic resin composition having high heat resistance and articles molded therefrom
申请人:Asahi Kasei Kogyo Kabushiki Kaisha
公开号:EP0044703A1
公开(公告)日:1982-01-27
A thermoplastic resin composition which has high heat resistance and high molding processability comprises 5-95% by wt. of a copolymer of a vinyl aromatic compound and an imide compound of an α,β-unsaturated dicarboxylic acid and 5-95% by wt. of a polyphenylene ether. The addition of up to 90% by wt. of an impact resistance reinforcing agent gives molded articles high impact resistance without affecting the processability or heat resistance of the composition. Articles are molded from the composition by conventional methods.