[EN] BISPHENOL DERIVATIVE THERAPEUTICS AND METHODS FOR THEIR USE [FR] AGENTS THÉRAPEUTIQUES À BASE DE DÉRIVÉS DU BISPHÉNOL ET MÉTHODES POUR LEUR UTILISATION
[EN] BISPHENOL DERIVATIVE THERAPEUTICS AND METHODS FOR THEIR USE [FR] AGENTS THÉRAPEUTIQUES À BASE DE DÉRIVÉS DU BISPHÉNOL ET MÉTHODES POUR LEUR UTILISATION
Hydrocurable compositions containing epoxy and oxazolidine or oxazine groups, their use as or in coating and impregnating compositions and polymer containing such groups
申请人:ROHM AND HAAS COMPANY
公开号:EP0033515A1
公开(公告)日:1981-08-12
Hydrocurable compositions are provided containing a plurality of epoxy groups and oxazolidine or oxazine groups which are storage stable for at least one month under anhydrous conditions. This stability is achieved by selecting oxazolidines or oxazines in which the 2-position carbon atom in the ring is free of hydrogen atoms and substituted by alkyl groups or an alkylene group which forms a hydrocarbon ring with that carbon atom. Upon exposure to moisture the oxa-groups ring open for reaction with the epoxy groups. The groups may be in the same or different components and thus the composition may comprise polyepoxide and a compound or polymer containing a plurality of the oxa-groups or a polymer containing both classes of groups. The latter polymer is one embodiment of the invention. The compositions may be used for coating, impregnating and adhesive purposes.
Polyhydroxy polyether, process for its production and its use
申请人:MITSUI PETROCHEMICAL INDUSTRIES, LTD.
公开号:EP0199564A2
公开(公告)日:1986-10-29
A substantially linear polyhydroxy polyether, which (1) is composed substantially of aromatic units and aliphatic units, the proportion of the aromatic units being 50 to 98 mole % based on the total amount of the aromatic units and the aliphatic units, (2) has an intrinsic viscosity, measured at 25°C in o-chlorophenol, of from 0.3 to 2 dl/g, and (3) has a glass transition temperature of from 30 to 120°C. Two processes for preparing the polyhydroxy polyether are proposed. The polyhydroxy polyether is useful in applications which require gas-barrier property.
A process for the manufacture of void-free prepreg sheets formed by the impregnation of a reinforcing cloth (e.g. glass fibre cloth) with a solution of a thermosetting resin (e.g. epoxy resin). In the process, the reinforcing cloth is first prewetted with a liqid medium containing a solvent for the resin which has a viscosity less than that of the solution of thermosetting resin. The prewetted cloth is impregnated with a solution of the resin and then heated to remove the solvent and cure the resin. The prepreg sheets are used in the manufacture of printed circuit boards.
A method of improving epoxy resin compositions to provide a cured resin having improved glass transition temperature and toughness characteristics is provided. The method includes providing in an epoxy resin composition an effective amount of a substituted fluorene unit in the composition. The fluorene component acts as a chain extension agent and provides for increased glass transition temperature and less cross-link density. As a result, improved toughness occurs. In preferred applications a toughening agent is provided in the resin composition, to further enhance toughness. Preferred resin compositions, cured resins and methods of providing improved cured resins are also provided.
A mixture of a liquid epoxy material and a hardener is selectively placed in a well traversing a subterranean formation adjacent to a zone in said formation which is to be plugged. The mixture is displaced into the zone and allowed to harden, thereby plugging the zone. The process is particularly applicable to sealing off water production in a gravel-packed well. A positive displacement bailer may be effectively used to deliver the mixture to the zone. The epoxy material used is immiscible with and is heavier than the fluid in the well. The epoxy material is further characterized as being essentially free of solids and having a low viscosity at downhole conditions of temperature and pressure. The hardener has an activation temperature which is lower than the downhole formation temperature.