2-(1-乙基戊基)-1H-苯并咪唑 | 99206-53-8

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并咪唑类
• 中文名称: 2-(1-乙基戊基)-1H-苯并咪唑
• 英文名称: 2-(heptan-3-yl)-1H-benzo[d]imidazole
• 英文别名: 2-(2-Ethylpentyl)benzimidazole；2-heptan-3-yl-1H-benzimidazole
• CAS: 99206-53-8
• 化学式: C₁₄H₂₀N₂
• mdl: MFCD01250322
• 分子量: 216.326
• InChiKey: VSMPBJCKGWINIB-UHFFFAOYSA-N

物化性质

• 沸点：
  379.8±11.0 °C(Predicted)
• 密度：
  1.024±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  4.7
• 重原子数：
  16
• 可旋转键数：
  5
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  28.7
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为产物：
  描述：

  N-(2-ethylhexyl)-2-iodoaniline 在 copper(l) iodide 、 sodium azide 、 四甲基乙二胺 、 N,N-二异丙基乙胺 作用下， 以 二甲基亚砜 为溶剂， 反应 24.0h， 以62%的产率得到2-(1-乙基戊基)-1H-苯并咪唑
  参考文献：
  名称：

  铜催化双 C-N 键形成，用于从 N-烷基-2-碘苯胺和叠氮化钠合成多种苯并咪唑

  摘要：

  通过铜催化 N-烷基-2-碘苯胺和叠氮化钠的双 C-N 键形成，实现了合成苯并咪唑衍生物的有效方法。该反应应该通过铜催化的 SNAr 反应串联反应、C(sp3)-H 键的有氧氧化和分子内 C-N 键形成序列进行。通过这种方法组装了结构多样的 2-芳基、烯基和烷基苯并咪唑衍生物。

  DOI：

  10.1055/s-0036-1588086

文献信息

• METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：EP3188577A1

  公开（公告）日：2017-07-05

  A method for selective deposition of an organic solderability preservative coating on a copper surface of an article is disclosed. The method includes two steps of organic coatings by two solutions; the first step contains contacting the copper surface with a first solution including azole compound and the second step contains contacting the copper surface treated by the first solution with a second solution including a specific pyrazine derived compound.

  本发明公开了一种在物品的铜表面选择性沉积有机可焊性防腐涂层的方法。该方法包括用两种溶液进行有机涂层的两个步骤；第一步是用包括唑化合物的第一种溶液接触铜表面，第二步是用包括特定吡嗪衍生化合物的第二种溶液接触经第一种溶液处理过的铜表面。
• FLUX
  申请人：Senju Metal Industry Co., Ltd

  公开号：EP3409412A1

  公开（公告）日：2018-12-05

  Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30 % by mass or more and 70 % by mass or less of the rosin, 1 % by mass or more and 10 % by mass or less of the organic acid, 0.2 % by mass or more and 10 % by mass or less of the benzimidazole-based compound, and 20 % by mass or more and 60 % by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

  本发明提供了一种助焊剂，即使在使用铜-OSP 加工基材时，也无需去除铜-OSP 薄膜的步骤即可进行焊接。这种助焊剂含有松香、有机酸、苯并咪唑类化合物和溶剂，其特征在于松香的质量百分比为 30%以上、70%以下，有机酸的质量百分比为 1%以上、10%以下，苯并咪唑类化合物的质量百分比为 0.2 %（质量百分比）以上和 10 %（质量百分比）以下的苯并咪唑基化合物，以及 20 %（质量百分比）以上和 60 %（质量百分比）以下的溶剂，其中苯并咪唑基化合物由 2-烷基苯并咪唑和 2-烷基苯并咪唑氢卤化物盐中的至少一种组成。
• ROSIN MODIFIED PRODUCT, FLUX COMPOSITION, LIQUID FLUX, FLUX CORED SOLDER AND SOLDER PASTE
  申请人：SENJU METAL INDUSTRY CO., LTD.

  公开号：EP3800003A1

  公开（公告）日：2021-04-07

  A rosin-modified product being a reactant of a rosin or a rosin derivative and an alkanolamine represented by a following Formula (1)          (1)     NH3-n-(R-OH)n (n ≤ 3) ; or being produced by a reaction of a rosin or a rosin derivative, an organic acid and an alkanolamine.

  一种松香改性产品 由松香或松香衍生物和下式（1）代表的烷醇胺组成的反应物 (1) NH3-n-(R-OH)n (n≤3) ； 或由松香或松香衍生物、有机酸和烷醇胺反应生成。
• RESIN COMPOSITION FOR SOLDERING USE, SOLDER COMPOSITION, FLUX CORED SOLDER, FLUX, AND SOLDER PASTE
  申请人：Senju Metal Industry Co., Ltd.

  公开号：EP3950983A1

  公开（公告）日：2022-02-09

  Provided are: a resin composition for soldering use, which has excellent compatibility with a rosin-based resin and excellent temperature cycle reliability and is therefore suitable for a flux for soldering use; and a soldering composition and a flux cored solder, in each of which the resin composition for soldering use is used. The resin composition for soldering use comprises: an acrylic resin having a number average molecular weight of 500 or more and less than 2000 as determined by mass spectrometry using a time-of-flight mass spectrometer; and a rosin-based resin, a polyethylene-based resin or a polypropylene-based resin. Alternatively, the resin composition for soldering use comprises: an acrylic resin having a weight average molecular weight of 500 or more and less than 2000 as determined by mass spectrometry using a time-of-flight mass spectrometer; and a rosin-based resin, a polyethylene-based resin or a polypropylene-based resin.

  提供了：一种焊接用树脂组合物，该组合物与松香基树脂具有良好的兼容性和优异的温度循环可靠性，因此适用于焊接用助焊剂；以及一种焊接组合物和一种助焊剂芯焊料，其中每一种都使用了该焊接用树脂组合物。焊接用树脂组合物包括：通过使用飞行时间质谱仪进行质谱测定，平均分子量大于或等于 500 但小于 2000 的丙烯酸树脂；以及松香基树脂、聚乙烯基树脂或聚丙烯基树脂。或者，焊接用树脂组合物包括：一种丙烯酸树脂，其重量平均分子量大于或等于 500，小于 2000（通过使用飞行时间质谱仪进行质谱测定）；以及一种松香基树脂、一种聚乙烯基树脂或一种聚丙烯基树脂。
• FLUX AND SOLDER PASTE
  申请人：Senju Metal Industry Co., Ltd.

  公开号：EP4063060A1

  公开（公告）日：2022-09-28

  Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

  本文提供了可改善焊料润湿性的助焊剂，以及使用该助焊剂的焊膏。该助焊剂含有 0.5-20.0 wt%的（2-羧基烷基）异氰尿酸酯加合物和 5.0-45.0 wt%的松香，还含有一种溶剂。(2-羧基烷基)异氰尿酸酯加合物是单(2-羧基烷基)异氰尿酸酯加合物、双(2-羧基烷基)异氰尿酸酯加合物、三(2-羧基烷基)异氰尿酸酯加合物或其中两种或两种以上的组合。