POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING THE SAME, PATTERNING PROCESS, AND LAMINATE
申请人:Shin-Etsu Chemical Co., Ltd.
公开号:EP3214497A1
公开(公告)日:2017-09-06
The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.
本发明提供了一种正性光敏树脂组合物,该组合物含有(A)含有硅氧烷链的高分子化合物,该高分子化合物具有通式(1)所示的重复单元,重量平均分子量为3,000至500,000;(B)能够在碱性水溶液中通过光产生酸并提高溶解速率的光敏材料;(C)交联剂;以及(D)溶剂。本发明提供了一种正性光敏树脂组合物,它可以解决在铜和铝等金属配线、电极和基板上,特别是在氮化硅等基板上产生的分层问题,并且在使用广泛使用的 2.38% TMAH 水溶液作为显影剂时,可以形成具有正锥形的精细图案,而不会在图案底部和基板上产生浮渣和脚底轮廓。