申请人:SHELL INTERNATIONALE RESEARCH
MAATSCHAPPIJ B.V.
公开号:EP0352868A1
公开(公告)日:1990-01-31
The processability and flex strength of a bismaleimide resin can be improved by blending the resin with an allylphenol novolac or allylphenol novolac ether resin.
申请人:SHELL INTERNATIONALE RESEARCH
MAATSCHAPPIJ B.V.
公开号:EP0516237A1
公开(公告)日:1992-12-02
The solution stability of a modified bisimide resin is enhanced by partially polymerizing a mixture of a bisimide monomer and a reactive triene which contains a conjugated double bond capable of Diels-Alder reaction with the bisimide. Such partial polymerization of a bisimide with a reactive triene such as myrcene provides a modified bisimide having good solubility in an organic solvent, and particularly suitable for electrical laminating applications.
申请人:SHELL INTERNATIONALE RESEARCH
MAATSCHAPPIJ B.V.
公开号:EP0525878A2
公开(公告)日:1993-02-03
A composition comprising a 1,2-dialkylidenecyclobutane such as 1,2-dimethylenecyclobutane and a polyimide such as a bismaleimide can be thermally cured to a tough copolymer having a high glass transition temperature and low water absorbance.
CURABLE EPOXY COMPOSITION AND CIRCIUT MATERIAL PREPREG, THERMOSET EPOXY COMPOSITION, AND ARTICLE PREPARED THEREFROM
申请人:SABIC Global Technologies B.V.
公开号:EP3567066A1
公开(公告)日:2019-11-13
A curable epoxy composition includes an epoxy resin, a hydroxyl-terminated polyphenylene ether, and an oligomeric aromatic organophosphate ester flame retardant, wherein at least 60% of the oligomeric aromatic organophosphate ester flame retardant includes at least two hydroxy terminal groups, and the amount of each component of the composition is specified herein. The composition can be particularly useful in circuit material prepregs, thermoset epoxy compositions, and various articles. A method for the manufacture of a thermoset composition is also described.
FUNCTIONAL PHENYLENE ETHER OLIGOMER AND CURABLE AND THERMOSET COMPOSITIONS PREPARED THEREFROM
申请人:SABIC Global Technologies B.V.
公开号:EP3567068A1
公开(公告)日:2019-11-13
A functional phenylene ether oligomer of the structure
wherein Q1, Q2, Q3, Q4, x, y, and R are as defined herein. A curable composition includes the functional phenylene ether oligomer, and a thermoset composition includes a cured product derived from the curable composition.
结构为功能性亚苯基醚低聚物
其中 Q1、Q2、Q3、Q4、x、y 和 R 如本文所定义。可固化组合物包括功能性亚苯基醚低聚物,热固性组合物包括由该可固化组合物衍生的固化产物。