申请人:Ito Atsushi
公开号:US20090239080A1
公开(公告)日:2009-09-24
An object of the present invention is to provide a cured product which is excellent in characteristics such as an electric insulation property, a heat impact resistance, an adhesive property and the like and to provide a photosensitive insulation resin composition from which the above cured product can be obtained and which is suited to uses such as an interlayer insulation film, a surface protecting layer and the like in semiconductor elements. The photosensitive insulation resin composition according to the present invention is characterized by comprising (A) a copolymer comprising 10 to 99 mole % of a constitutional unit (A1) represented by the following Formula (1) and 90 to 1 mole % of a constitutional unit (A2) represented by the following Formula (2) (provided that the total of all constitutional units constituting the above copolymer (A) is 100 mole %):
(wherein R
1
represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group or an aryl group; R
2
represents a hydrogen atom or methyl; m is an integer of 1 to 3, and n is an integer of 0 to 3; and m+n≦5; R
3
represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group or an aryl group; R
4
represents a hydrogen atom or methyl; and k is an integer of 0 to 3), (B) a compound (B1) having an oxetanyl group, (C) a photosensitive acid generator, (D) a solvent and (F) cross-linked fine particles.
本发明的目的是提供一种具有优异的电气绝缘性、耐热冲击性、粘附性等特性的固化产品,并提供一种光敏绝缘树脂组合物,该组合物适用于半导体元件中的层间绝缘膜、表面保护层等用途。本发明的光敏绝缘树脂组合物的特点在于包括(A)共聚物,该共聚物包括以下式(1)所表示的构成单元(A1)的10至99摩尔%和以下式(2)所表示的构成单元(A2)的90至1摩尔%(其中,构成上述共聚物(A)的所有构成单元的总和为100摩尔%):(式中,R1表示具有1至4个碳原子的烷基、烷氧基或芳基;R2表示氢原子或甲基;m为1至3的整数,n为0至3的整数;且m+n≤5;R3表示具有1至4个碳原子的烷基、烷氧基或芳基;R4表示氢原子或甲基;k为0至3的整数),(B)具有氧杂环丙基基团的化合物(B1),(C)光敏酸发生剂,(D)溶剂和(F)交联细粒子。