申请人:TOMOEGAWA PAPER CO. LTD.
公开号:EP0649892A1
公开(公告)日:1995-04-26
This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.
The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I):
wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.
本发明旨在提供一种可在相对较低温度下粘合和固化并具有足够耐热性和可靠性等优点的本发明液体粘合剂,以及使用该粘合剂的胶带。
本发明的液体粘合剂可通过溶解 (a) 含哌嗪基乙基氨基羰基的丁二烯-丙烯腈共聚物来获得,该共聚物的重量平均分子量为 10,000-200,000 ,丙烯腈含量为 5-50%(重量百分比),氨基当量为 500-10,000 ,由下式(I)表示:
其中,k、m 和 n 为摩尔比,取 n 为 1,k 为 3-175 的数值,m 为 0.3 至 93 的数值;以及 (b) 具有至少两个马来酰亚胺基团的化合物,组分(b)与 100 重量份组分(a)的比率为 10 至 900 重量份。将其涂在耐热薄膜的一个表面或两个表面上,或涂在离型膜的一个表面上,形成粘合层,从而获得用于电子零件的胶带。