2-甲氧基-1,3,4,5-四甲基苯 | 780771-26-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 中文名称: 2-甲氧基-1,3,4,5-四甲基苯
• 英文名称: 2,3,4,6-tetramethyl-anisole
• 英文别名: 2,3,4,6-Tetramethyl-anisol；2-Methoxy-1,3,4,5-tetramethylbenzene
• CAS: 780771-26-8
• 化学式: C₁₁H₁₆O
• 分子量: 164.247
• InChiKey: YUDITUHXYJCWCV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.4
• 重原子数：
  12
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.45
• 拓扑面积：
  9.2
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  2-甲氧基-1,3,4,5-四甲基苯 在 吡啶盐酸盐 作用下， 生成 2,3,4,6-四甲基苯酚
  参考文献：
  名称：

  Buu-Hoi et al., Comptes Rendus Hebdomadaires des Seances de l'Academie des Sciences, 1955, vol. 240, p. 2241

  摘要：

  DOI：
• 作为产物：
  描述：

  1-甲氧基-2,4,5-三甲基苯 在 氢氧化钾 、 一水合肼 、 三氯氧磷 、 二乙二醇 作用下， 反应 2.0h， 生成 2-甲氧基-1,3,4,5-四甲基苯
  参考文献：
  名称：

  Buu-Hoi et al., Comptes Rendus Hebdomadaires des Seances de l'Academie des Sciences, 1955, vol. 240, p. 2241

  摘要：

  DOI：

文献信息

• DNA-PK INHIBITORS
  申请人：Vertex Pharmaceuticals Incorporated

  公开号：US20130281431A1

  公开（公告）日：2013-10-24

  The present invention relates to compounds useful as inhibitors of DNA-PK. The invention also provides pharmaceutically acceptable compositions comprising said compounds and methods of using the compositions in the treatment of various disease, conditions, or disorders.

  本发明涉及作为DNA-PK抑制剂的化合物。该发明还提供了包含所述化合物的药物可接受的组合物，以及使用所述组合物治疗各种疾病、状况或失调的方法。
• [EN] COMPOUND, PHOTOPOLYMERIZATION INITIATOR, PHOTOCURABLE COMPOSITION AND CURED PRODUCT THEREOF, AND PHOTOCURABLE INK AND PRINT USING THE SAME<br/>[FR] COMPOSÉ, INITIATEUR DE PHOTOPOLYMÉRISATION, COMPOSITION PHOTODURCISSABLE ET PRODUIT DURCI ASSOCIÉ, ENCRE PHOTODURCISSABLE ET IMPRESSION L'UTILISANT
  申请人：DAINIPPON INK & CHEMICALS

  公开号：WO2019071428A1

  公开（公告）日：2019-04-18

  There are provided a compound represented by general formula (1), a photopolymerization initiator comprising this compound, a photocurable composition having this photopolymerization initiator and a photocurable compound as essential components, and a cured product formed by curing this photocurable composition, wherein in formula (l), R1 and R2 each independently represents an alkyl group or the like; R3 to R5 each independently represent a hydrogen atom, an alkyl group or the like; X1 represents a single bond or an alkylene group; and X2 represents a bonding group represented by general formulas (2) to (4), and wherein n represents an integer of 1 to 6, when n is an integer of 1, Y represents an alkyl group, an aryl group or the like.

  提供了一个化合物，其通式表示为（1），包括该化合物的光聚合引发剂，具有该光聚合引发剂和光固化化合物作为基本组分的光固化组合物，以及通过固化该光固化组合物形成的固化产物，其中在通式（1）中，R1和R2分别独立表示烷基基团或类似物；R3至R5分别独立表示氢原子、烷基基团或类似物；X1表示单键或烷基烃基团；X2表示由通式（2）至（4）表示的键合基团，其中n表示1至6的整数，当n为1时，Y表示烷基基团、芳基基团或类似物。
• Bismaleamic acid, bismaleimide and cured product thereof
  申请人：Uera Kazuyoshi

  公开号：US20090312519A1

  公开（公告）日：2009-12-17

  A bismaleamic acid obtained by reacting a bifunctional phenylene ether oligomer diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with maleic anhydride, a bismaleimide obtained from the bismaleamic acid as a raw material, which bismaleimide has high heat resistance, low dielectric characteristics and excellent solvent solubility and exhibits only a small change in dielectric characteristics even in high humidity, a curable resin composition containing the above bismaleimide and a cured product obtained by curing the curable resin composition.

  通过将具有芳香族氨基团的双官能苯醚寡聚二胺与马来酸酐反应获得的双马来酰胺酸，再以该双马来酰胺酸为原料制备的双马来酰亚胺，该双马来酰亚胺具有高耐热性、低介电特性和优异的溶剂溶解性，即使在高湿度条件下也仅表现出微小的介电特性变化，以及包含上述双马来亚胺的可固化树脂组合物和通过固化可固化树脂组合物获得的固化产物。
• Curable resin composition
  申请人：Kawabe Masanao

  公开号：US20070129502A1

  公开（公告）日：2007-06-07

  Provided is curable resin composition which gives a cured article excellent in chemical resistance, dielectric properties, low water-absorption, heat resistance, flame retardance, and mechanical properties and which is usable in applications such as dielectric materials, insulating materials, heat-resistant materials, and structural materials. The curable resin composition includes a component (A) which is a polyphenylene ether oligomer having a number-average molecular weight of 700 to 4,000 and having a vinyl group at both end and a component (B) which is a solvent-soluble polyfunctional vinylaromatic copolymer which has structural units derived from monomers including a divinylaromatic compound (a) and an ethylvinylaromatic compound (b) and in which the content of repeating units derived from the divinylaromatic compound (a) is 20 mol % or higher, the ratio of the amount (wt. %) of the component (A) to that (wt. %) of the component (B) being (20 to 98):(2 to 80). The composition can further contain a layered silicate, a halogenated flame retardant, etc.

  提供了一种可治愈的树脂组合物，其使得固化后的制品具有出色的化学耐性、介电性能、低吸水性、耐热性、阻燃性和机械性能，并可用于介电材料、绝缘材料、耐热材料和结构材料等应用。该可治愈的树脂组合物包括以下组分：(A)是一种聚苯醚寡聚体，其具有700至4,000的数量平均分子量，并在两端具有乙烯基；(B)是一种可溶于溶剂的多功能乙烯基芳香族共聚物，其具有从单体中衍生出的结构单元，包括一种二乙烯基芳香族化合物(a)和一种乙基乙烯基芳香族化合物(b)，其中重复单元中来自二乙烯基芳香族化合物(a)的含量为20摩尔%或更高，组分(A)与组分(B)的重量比为(20至98)∶(2至80)。该组合物还可以进一步包含层状硅酸盐、卤素阻燃剂等。
• Resin composition, prepreg and metal foil-clad laminate
  申请人：Oka Naoki

  公开号：US10028377B2

  公开（公告）日：2018-07-17

  Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h).

  本发明提供了一种树脂组合物，该树脂组合物在吸湿后具有优异的电气特性和耐热性，并且在生产层压板时具有优异的流动特性，还提供了使用该树脂组合物的预浸料、金属箔包覆层压板和树脂板。所使用的树脂组合物包含具有聚苯醚骨架的双官能团亚苯基醚低聚物（a）、烷基氰酸酯化合物（b）、双酚基氰酸酯化合物（c）、环氧树脂（d）、溴化碳酸酯低聚物（e）、无机填料（f）、烷氧基萘酚基聚合抑制剂（g）和/或硫醚基聚合抑制剂（h）。