2-Hydroxy-N-phenyl-maleinimid | 91311-33-0

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯啉
• 英文名称: 2-Hydroxy-N-phenyl-maleinimid
• 英文别名: 3-Hydroxy-1-phenylpyrrole-2,5-dione
• CAS: 91311-33-0
• 化学式: C₁₀H₇NO₃
• 分子量: 189.17
• InChiKey: KBCCSWZVZVMLHZ-UHFFFAOYSA-N

物化性质

• 沸点：
  339.0±42.0 °C(Predicted)
• 密度：
  1.510±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  0.9
• 重原子数：
  14
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  57.6
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  2-Hydroxy-N-phenyl-maleinimid 、 双(2-氨基苯基)二硫 以 溶剂黄146 为溶剂， 生成 1,4-benzothiazine-2,3-dicarboxylic acid N-phenylimide
  参考文献：
  名称：

  Augustin, Manfred; Jeschke, Peter, Zeitschrift fur Chemie, 1987, vol. 27, # 6, p. 211 - 212

  摘要：

  DOI：
• 作为产物：
  描述：

  2-Ethoxycarbonyl-3-hydroxy-N-phenyl-maleinimid 以 溶剂黄146 为溶剂， 生成 2-Hydroxy-N-phenyl-maleinimid
  参考文献：
  名称：

  Augustin, Manfred; Jeschke, Peter, Zeitschrift fur Chemie, 1987, vol. 27, # 6, p. 211 - 212

  摘要：

  DOI：

文献信息

• Curable resin composition and cold-setting adhesive
  申请人：Mori Shigeki

  公开号：US20060189736A1

  公开（公告）日：2006-08-24

  Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX 1 X 2 X 3 or —SiR 1 X 1 X 2 (wherein, X 1 , X 2 and X 3 respectively represent a hydrolytic group and may be the same as or different from each other, and R 1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR 1 X 1 X 2 , the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.

  本发明公开了一种含有湿气硬化型可硬化树脂组分，包括：具有含硅官能团的可硬化树脂分子内部；以及一种Lewis酸或Lewis酸的复合物作为固化催化剂，所述Lewis酸选自金属卤化物和硼卤化物组成的群体，该组分在室温下迅速固化。所述含硅官能团由下式表示：—SiX1X2X3或—SiR1X1X2（其中，X1、X2和X3分别表示水解基团，可以相同也可以不同，R1表示具有1到20个碳的取代或未取代的有机基团）。如果所述含硅官能团为—SiR1X1X2，则可硬化树脂还包括分子内部的极性成分，该极性成分是尿素、硫脲、脲、硫代脲、取代脲、取代硫脲、酰胺和硫化物键以及羟基、二级胺和三级胺基之一。两部分型粘合剂可通过将可硬化树脂与固化催化剂分离而形成。
• Curable Resin Composition and Cold Setting Adhesive
  申请人：Mori Shigeki

  公开号：US20090264602A1

  公开（公告）日：2009-10-22

  Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX 1 X 2 X 3 or —SiR 1 X 1 X 2 (wherein, X 1 , X 2 and X 3 respectively represent a hydrolytic group and may be the same as or different from each other, and R 1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR 1 X 1 X 2 , the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.

  本发明公开了一种含有湿度固化型可固化树脂组成物，包括：具有硅含有官能团的可固化树脂分子内部；以及作为固化催化剂的路易斯酸或路易斯酸的复合物，所述路易斯酸选择自金属卤化物和硼卤化物的组中，该组成物在室温下快速固化。硅含有官能团由通式表示：—SiX1X2X3或—SiR1X1X2（其中，X1、X2和X3分别表示一个水解基团，可以相同或不同，R1表示具有1到20个碳的取代或未取代的有机基团）。如果硅含有官能团为—SiR1X1X2，则可固化树脂还包含分子内部的极性组分之一，该极性组分为脲、硫脲、尿素、硫代尿素、取代尿素、取代硫脲、酰胺和硫化物键以及羟基、次级氨基和三级氨基基团。可将可固化树脂与固化催化剂分离以构成两部分型粘合剂。
• CURABLE RESIN COMPOSITION
  申请人：Konishi Co., Ltd.

  公开号：EP1514903A1

  公开（公告）日：2005-03-16

  There is provided a composition comprising a sililated urethane resin having a polyoxyalkylene polymer as its main chain, having a reactive silicon group at a terminal of the molecule and having a substituted urea bond in the molecule, a diluent (B) having a boiling point of not lower than 250°C and a curing catalyst (C), wherein the curing catalyst (C) is a reaction product of a poly(dialkylstannoxane) dicarboxylate represented by the following general formula (1) and a silicate compound represented by the general formula R3nSi(OR4)4-n (2).

  提供了一种组合物，该组合物包括硅化聚氨酯树脂，其主链为聚氧亚烷基聚合物，分子末端具有活性硅基，分子中具有取代的脲键、沸点不低于 250℃的稀释剂(B)和固化催化剂(C)，其中固化催化剂(C)是下 列通式(1)表示的聚(二烷基锡氧烷)二羧酸盐和通式 R3nSi(OR4)4-n(2) 表示的硅酸盐化合物的反应产物。
• CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION
  申请人：KONISHI CO., LTD.

  公开号：EP1616886A1

  公开（公告）日：2006-01-18

  An object of the present invention is to provide a curable resin having a silyl group at the terminal that is also moisture-hardening resin which has lower in viscosity when it is used and provides superior adhesiveness when it is utilized for adhesive, sealant, and paint. The object of the invention could be achieved by a curable resin that has silicon atom-containing groups having a silicon atom bound to one or more hydrolysable groups such as alkoxy groups, acetoxy groups and oxim groups at the ends of the molecule , thioether and hydroxyl groups in the molecule, and a polymer having a polyoxyalkylene, (meth)acrylic ester, or hydrocarbon polymer as the main chain skeleton.

  本发明的目的是提供一种末端带有硅基的可固化树脂，它也是一种湿硬化树脂，使用时粘度较低，用于粘合剂、密封剂和涂料时具有优异的粘合性。本发明的目的可以通过以下方法实现：一种可固化树脂，其含有硅原子，硅原子与一个或多个可水解基团结合，如分子末端的烷氧基、乙酰氧基和肟基，分子中的硫醚和羟基，以及以聚氧亚烷基、（甲基）丙烯酸酯或烃类聚合物作为主链骨架的聚合物。
• CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE
  申请人：KONISHI CO., LTD.

  公开号：EP1652891A1

  公开（公告）日：2006-05-03

  Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: -SiX1X2X3 or -SiR1 X1 X2 (wherein, X1, X2 and X3 respectively represent a hydrolytic group and may be the same as or different from each other, and R1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is -SiR1 X1 X2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.

  本发明公开了一种湿气固化型可固化树脂组合物，该组合物含有：分子内具有含硅官能团的可固化树脂；以及作为固化催化剂的路易斯酸或路易斯酸的复合物，路易斯酸选自金属卤化物和硼卤化物组成的组，可在室温下快速固化。含硅官能团由通式表示：-SiX1X2X3或-SiR1 X1 X2（其中，X1、X2和X3分别代表水解基团，可以相同或不同，R1代表具有1至20个碳原子的取代或未取代的有机基团）。如果含硅官能团为-SiR1 X1 X2，则可固化树脂分子内进一步含有极性组分，该极性组分为聚氨酯、硫氨酯、脲、硫脲、取代脲、取代硫脲、酰胺键、硫化物键以及羟基、仲氨基和叔氨基中的一种。双组分型粘合剂可将可固化树脂与固化催化剂分开。