tin(II) adipate | 112131-14-3

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: tin(II) adipate
• 英文别名: Hexanedioate;tin(2+)；hexanedioate;tin(2+)
• CAS: 112131-14-3
• 化学式: C₆H₈O₄*Sn
• 分子量: 262.837
• InChiKey: LTCDUZSZNPSELB-UHFFFAOYSA-L

计算性质

• 辛醇/水分配系数(LogP)：
  0.18
• 重原子数：
  11
• 可旋转键数：
  0
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.67
• 拓扑面积：
  52.6
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  tin(II) adipate 以 neat (no solvent) 为溶剂， 生成 stannous carbonate 、 二氧化碳 、 tin(II) oxide
  参考文献：
  名称：

  Characterization of nitrogen-blanketed wave soldering reactions using thermal analysis

  摘要：

  Thermal analysis techniques have been employed to elucidate the mechanism of low solids soldering flux activation. Metal oxides (SnO, PbO and PbO2) are converted to carboxylate salts, which are displaced in the solder wave, rendering a solderable metal surface. Neither of the activators tested, namely succinic acid and adipic acid, react with SnO2 at soldering wave temperatures and therefore cannot yield a solderable surface when SnO2 is present. Further, adipic acid reacts with SnO to form a salt that can decompose to cyclopentanone, so the preheating of the printed circuit board must be carefully controlled to yield a solderable surface.

  DOI：

  10.1007/bf02549214
• 作为产物：
  描述：

  氯化亚锡 、 己二酸 生成 tin(II) adipate
  参考文献：
  名称：

  OZIMINA, D.;KAJDAS, C., ASLE TRANS, 30,(1987) N 4, 508-518

  摘要：

  DOI：

文献信息

• OZIMINA, D.;KAJDAS, C., ASLE TRANS, 30,(1987) N 4, 508-518
  作者：OZIMINA, D.、KAJDAS, C.

  DOI：——

  日期：——
• Characterization of nitrogen-blanketed wave soldering reactions using thermal analysis
  作者：M. L. Patterson、M. H. Hahn

  DOI：10.1007/bf02549214

  日期：1995.6

  Thermal analysis techniques have been employed to elucidate the mechanism of low solids soldering flux activation. Metal oxides (SnO, PbO and PbO2) are converted to carboxylate salts, which are displaced in the solder wave, rendering a solderable metal surface. Neither of the activators tested, namely succinic acid and adipic acid, react with SnO2 at soldering wave temperatures and therefore cannot yield a solderable surface when SnO2 is present. Further, adipic acid reacts with SnO to form a salt that can decompose to cyclopentanone, so the preheating of the printed circuit board must be carefully controlled to yield a solderable surface.