The invention provides a composition for forming a silicon-containing resist underlayer film comprising:
(A) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (1) and one or more hydrolysable compound shown by the following general formula (2), and (B) a silicon-containing compound obtained by a hydrolysis-condensation reaction of a mixture containing, at least, one or more hydrolysable silicon compound shown by the following general formula (3) and one or more hydrolysable silicon compound shown by the following general formula (4). There can be provided a composition for forming a resist underlayer film applicable not only to a resist pattern obtained in a negative development but also to a resist pattern obtained in a conventional positive development, and a patterning process using this composition.
R1m1R2m2R3m3Si(OR)(4-m1-m2-m3) (1)
U(OR4)m4(OR5)m5 (2)
R6m6R7m7R8m8Si(OR9)(4-m6-m7-m8) (3)
Si(OR10)4 (4)
本发明提供了一种用于形成含
硅抗蚀剂底层薄膜的组合物,该组合物包括
(A)由至少含有下式(1)所示的一种或多种可
水解
硅化合物和下式(2)所示的一种或多种可
水解化合物的混合物经
水解-缩合反应得到的含
硅化合物,和(B)由至少含有下式(3)所示的一种或多种可
水解
硅化合物和下式(4)所示的一种或多种可
水解
硅化合物的混合物经
水解-缩合反应得到的含
硅化合物。本发明提供了一种用于形成抗蚀剂底层薄膜的组合物,该组合物不仅适用于在负显影中获得的抗蚀剂图案,也适用于在传统正显影中获得的抗蚀剂图案,还提供了一种使用该组合物的图案化工艺。
R1m1R2m2R3m3Si(OR)(4-m1-m2-m3) (1)
U(OR4)m4(OR5)m5 (2)
R6m6R7m7R8m8Si(OR9)(4-m6-m7-m8) (3)
Si(OR10)4 (4)