The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1): -25≦E1-E0E0×100≦25
wherein E0 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition is cured at the 21st step of the density 1.00 of a 41-step step tablet having a density range from 0.00 to 2.00, a density step of 0.05, a tablet size of 20 mm × 187 mm and a step size of 3 mm × 12 mm, by irradiation with a full wavelength active light of a high pressure mercury lamp and E1 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition after being left for 2 hours under 40 W non-ultraviolet white lamp is cured at the 21st step of the 41-step step tablet by irradiation with a full wavelength active light from a high pressure mercury lamp.
本发明提供了一种用于激光扫描曝光的光敏
树脂组合物,其满足下式(1):-25≦E1-E0E0×100≦25
其中 E0 表示光敏
树脂组合物在密度范围为 0.00 至 2.00 的 41 步压片密度 1.00 的第 21 步时固化的曝光量(单位:mJ/cm2),密度步长为 0.E1 表示光敏
树脂组合物在 40 W 非紫外线白光灯下放置 2 小时后,通过高压
汞灯的全波长有效光照射,在 41 步片剂的第 21 步固化时的曝光量,单位为 mJ/cm2。