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1,10-decanedicarboxylic anhydride | 137162-15-3

中文名称
——
中文别名
——
英文名称
1,10-decanedicarboxylic anhydride
英文别名
12-(11-Carboxyundecanoyloxy)-12-oxododecanoic acid;12-(11-carboxyundecanoyloxy)-12-oxododecanoic acid
1,10-decanedicarboxylic anhydride化学式
CAS
137162-15-3
化学式
C24H42O7
mdl
——
分子量
442.593
InChiKey
IVZVMIDYHDCGKP-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    6.7
  • 重原子数:
    31
  • 可旋转键数:
    24
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.83
  • 拓扑面积:
    118
  • 氢给体数:
    2
  • 氢受体数:
    7

反应信息

  • 作为反应物:
    描述:
    1,10-decanedicarboxylic anhydride 在 AlCl3 作用下, 以 盐酸sodium hydroxide 为溶剂, 生成 11-Benzoyl-undecansaeure
    参考文献:
    名称:
    Lipoxygenase inhibitory compounds
    摘要:
    式为##STR1##的化合物,其中n=6-11,M为氢或药用可接受的阳离子,R为氢或C.sub.1 -C.sub.6烷基,可以选择地被羧基取代,而X.sub.a、X.sub.b和X.sub.c分别独立地表示氢或多种取代基团,是5-脂氧合酶的强效抑制剂。
    公开号:
    US04861798A1
  • 作为产物:
    描述:
    参考文献:
    名称:
    Lipoxygenase inhibitory compounds
    摘要:
    式为##STR1##的化合物,其中n=6-11,M为氢或药用可接受的阳离子,R为氢或C.sub.1 -C.sub.6烷基,可以选择地被羧基取代,而X.sub.a、X.sub.b和X.sub.c分别独立地表示氢或多种取代基团,是5-脂氧合酶的强效抑制剂。
    公开号:
    US04861798A1
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文献信息

  • PROCESS FOR GENERATING ACID ANHYDRIDES
    申请人:Hyconix, Inc.
    公开号:US20210347722A1
    公开(公告)日:2021-11-11
    Provided is a method of producing an anhydride of an organic mono-acid comprising contacting an organic mono-acid and a thermally regenerable anhydride to produce the anhydride of the organic mono-acid, and either a diacid of the regenerable anhydride, a partially hydrolyzed regenerable anhydride, or both. In a particular example, acetic acid and glutaric anhydride can be reacted to form acetic anhydride.
    提供了一种生产有机单酸酐的方法,包括将有机单酸和热再生酐酸接触以产生有机单酸酐,以及再生酐酸的二酸、部分水解的再生酐酸或两者之一。在一个特定的例子中,可以将乙酸和戊二酸酐反应形成乙酸酐。
  • Modified polyanhydride curing agent for polyepoxide type powder coatings
    申请人:PPG INDUSTRIES, INC.
    公开号:EP0299420A2
    公开(公告)日:1989-01-18
    There is disclosed herein an improved thermosetting powder coating composition comprising an epoxy resin and a curing agent, the improvement comprising the curing agent which is a polyol-modified polymeric polyanhydride containing anhydride linkages in the polymeric backbone.
    本文公开了一种改进型热固性粉末涂料组合物,该组合物由环氧树脂和固化剂组成,其改进之处在于固化剂是一种多元醇改性聚合物聚酐,在聚合物主链中含有酸酐链节。
  • EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
    申请人:Nippon Kayaku Kabushiki Kaisha
    公开号:EP1548043A1
    公开(公告)日:2005-06-29
    The present invention relates to an epoxy resin composition for sealing photosemiconductor, the epoxy resin composition containing (A) a bisphenol-type epoxy resin represented by the following formula (1) (in the formula, R1s represent hydrogen atom, a C1 - C8 alkyl group, a halogen atom; R2s represent hydrogen atom, a C1 - C5 alkyl group, a halogen-substituted (C1 - C5) alkyl group or phenyl group; n represents an integer), where the ratio of the total content of such bisphenol-type lower molecular epoxy resins with n = 0, 1 or 2 is 10% by weight or more of the whole resin; (B) a terpene backbone-containing polyvalent phenol curing agent prepared by adding two molecules of phenols to one molecule of a cyclic terpene compound; (C) a curing-promoting agent; (D) at least one resin selected from the group consisting of epoxy resins except for the component (A) and novolak resins as a curing agent; and an photosemiconductor device sealed with the cured material of the composition, where the composition has great workability and good productivity of sealed photosemiconductor, so that the resulting photosemiconductor sealed with the cured material of the composition has great solder reflowresistance after moisture absorption and good thermal resistance for HC.
    本发明涉及一种用于密封光半导体的环氧树脂组合物,该环氧树脂组合物包含 (A) 由下式(1)表示的双酚型环氧树脂 (式中,R1s 代表氢原子、C1-C8 烷基、卤素原子;R2s 代表氢原子、C1-C5 烷基、卤素取代的(C1-C5)烷基或苯基;n 代表整数),其中,n=0、1 或 2 的双酚型低分子环氧树脂的总含量占整个树脂重量的比例为 10%或以上; (B) 一种含萜烯骨架的多价酚固化剂,其制备方法是在一分子环状萜烯化合物中 加入两分子酚,其中一分子酚的重量比为 10%或以上; (C) 一种固化促进剂; (D) 至少一种选自环氧树脂(成分(A)除外)和酚醛树脂组成的组的树脂作为固化剂; 以及用该组合物的固化材料密封的光电半导体器件,其中该组合物具有极佳的可加工性和密封光电半导体的良好生产率,因此用该组合物的固化材料密封的光电半导体在吸湿后具有极佳的耐回流焊性和良好的耐热性。
  • CURABLE RESIN COMPOSITION AND INTERLAYER INSULATING FILM
    申请人:DAICEL CHEMICAL INDUSTRIES, LTD.
    公开号:EP1840149A1
    公开(公告)日:2007-10-03
    A curable resin composition includes a cycloaliphatic epoxy compound of following Formula (1): wherein R represents hydrogen atom or a hydrocarbon group having one to five carbon atoms; and A represents a group selected from ether group, thioether group, sulfonyl group, carbonyl group, carbonate group, ester group, and acetal group; and a cationic polymerization initiator or a curing agent. The cationic polymerization initiator can be a heat-induced cationic polymerization initiator or a photo-induced cationic polymerization initiator. The curing agent can be a polybasic acid anhydride.
    一种可固化树脂组合物包括下式 (1) 的环脂族环氧化合物: 其中 R 代表氢原子或具有一至五个碳原子的烃基;A 代表选自醚基、硫醚基、磺酰基、羰基、碳酸酯基、酯基和缩醛基的基团;以及阳离子聚合引发剂或固化剂。阳离子聚合引发剂可以是热引发阳离子聚合引发剂或光引发阳离子聚合引发剂。固化剂可以是聚碱性酸酐。
  • PHOTO- AND/OR THERMO-CURABLE COPOLYMER, CURABLE RESIN COMPOSITIONS, AND CURED ARTICLES
    申请人:Daicel Chemical Industries, Ltd.
    公开号:EP2147937A1
    公开(公告)日:2010-01-27
    Disclosed is a photo- and/or thermo-curable copolymer having polymerizable unsaturated groups in side chains, which is obtainable by reacting a copolymer (P) with an epoxy-containing polymerizable unsaturated compound (C), the copolymer (P) containing monomer units derived from a carboxyl-containing polymerizable unsaturated compound (A) and monomer units derived from at least one epoxy-containing polymerizable unsaturated compound (B) represented by following Formula (1) or (2), in which the epoxy group of the epoxy-containing polymerizable unsaturated compound (C) has been added to part of the carboxyl groups of the copolymer (P). In the formulae, Ras each represent hydrogen or hydroxyl-substituted or -unsubstituted alkyl having 1 to 4 carbon atoms; and Rbs each represent single bond or alkylene having 1 to 18 carbon atoms which may contain heteroatom(s). The curable copolymer is highly stably synthesized and stored, has satisfactory curing properties, and permits both epoxy crosslinking and radical crosslinking.
    本发明公开了一种光固化和/或热固化共聚物,其侧链中含有可聚合的不饱和基团,该共聚物可通过共聚物(P)与含环氧基的可聚合不饱和化合物(C)反应而获得、共聚物(P)含有来自含羧基可聚合不饱和化合物(A)的单体单元和来自至少一种由下式(1)或(2)表示的含环氧基可聚合不饱和化合物(B)的单体单元,其中含环氧基可聚合不饱和化合物(C)的环氧基已加到共聚物(P)的部分羧基上。式中,Ras 分别代表氢或具有 1 至 4 个碳原子的羟基取代或未取代的烷基;Rbs 分别代表单键或具有 1 至 18 个碳原子的亚烷基,其中可能含有杂原子。这种可固化共聚物的合成和储存非常稳定,具有令人满意的固化性能,并允许环氧交联和自由基交联。
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