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3-[4,5-Bis(hydroxymethyl)-2-phenyl-1H-imidazol-1-yl]propanenitrile | 679407-11-5

中文名称
——
中文别名
——
英文名称
3-[4,5-Bis(hydroxymethyl)-2-phenyl-1H-imidazol-1-yl]propanenitrile
英文别名
3-[4,5-bis(hydroxymethyl)-2-phenylimidazol-1-yl]propanenitrile
3-[4,5-Bis(hydroxymethyl)-2-phenyl-1H-imidazol-1-yl]propanenitrile化学式
CAS
679407-11-5
化学式
C14H15N3O2
mdl
——
分子量
257.29
InChiKey
ANGLWFRTZCOBHB-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    -0.4
  • 重原子数:
    19
  • 可旋转键数:
    5
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.29
  • 拓扑面积:
    82.1
  • 氢给体数:
    2
  • 氢受体数:
    4

文献信息

  • Releasable microcapsule and adhesive curing system using the same
    申请人:Cookson Electronics, Inc.
    公开号:EP1411102A1
    公开(公告)日:2004-04-21
    An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire surface of the accelerator. The epoxy adhesive is cured by exposing it to infrared energy. The infrared energy is absorbed by the infrared absorber which disintegrates the wall and allows the accelerator to come into contact with the other adhesive components and initiate the curing polymerization reaction.
    一种未固化环氧树脂粘合剂,包括树脂成分、固化剂成分和微胶囊促进剂成分。微胶囊加速器组件包括红外线吸收器、加速器和基本上覆盖加速器整个表面的壁。环氧树脂粘合剂在红外线照射下固化。红外线能量被红外线吸收器吸收,红外线吸收器使壁分解,使促进剂与其他粘合剂成分接触,启动固化聚合反应。
  • HEAT-CURABLE INK COMPOSITION
    申请人:SHOWA DENKO K.K.
    公开号:EP2380937A1
    公开(公告)日:2011-10-26
    The present invention provides a thermosetting ink composition having excellent balance concerning screen printability capable of preventing oozing and bleeding at the time of screen printing, electric insulating reliability and adhesion with an objective for coating. The thermosetting ink composition of the invention comprises a thermosetting resin (A) having a value "a" of less than 0.60 in the following formula (1) showing the relationship between the intrinsic viscosity [η] and the absolute molecular weight M of the resin: η=K xMa wherein K is a constant number. Since the thermosetting ink composition can prevent oozing and bleeding at the time of screen printing and an excessive amount of a filler is not used for improving the printability, it can form excellent solder resists and other protective films at low coat without decreasing the electric insulating reliability and adhesion with an objective for coating.
    本发明提供了一种热固性油墨组合物,该组合物在丝网印刷性、防止丝网印刷时渗出和出血的能力、电绝缘可靠性和与目标涂层的附着力方面具有良好的平衡。本发明的热固性油墨组合物包括热固性树脂 (A),其 "a "值小于 0.60,如下式 (1)表示树脂的固有粘度 [η]和绝对分子量 M 之间的关系: η=K xMa 其中 K 为常数。 由于该热固性油墨组合物可以防止丝网印刷时的渗出和出血,并且没有为提高印刷适性而使用过量的填料,因此可以在不降低电绝缘可靠性和附着力的情况下,在低涂层下形成优异的阻焊和其他保护膜,从而达到涂层的目的。
  • ONE PART EPOXY RESIN INCLUDING A LOW PROFILE ADDITIVE
    申请人:Trillion Science, Inc.
    公开号:EP2561029A2
    公开(公告)日:2013-02-27
  • Epoxy compositions
    申请人:Xu Qianfei
    公开号:US20080090943A1
    公开(公告)日:2008-04-17
    An epoxy composition for applications such as one-part adhesives, coatings, prepreg and molding compounds that includes leuco dyes, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, or cycloalkylamino-functional group on one of the aromatic rings, as a co-catalyst or co-curing agent. The use of the leuco dye co-catalyst provides improved curing speed of the epoxy composition comprising a latent curing agent/catalyst such as Novacure imidazole microcapsules while maintaining the shelf-life stability. The epoxy may also include a secondary co-catalyst that includes amides and lactams, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, or dicycloalkylamino-functional group. Secondary cocatalysts of low mobility at the storage conditions, such as those with a long chain substitutent, dimeric or oligomeric amides or lactams, are particularly preferred. The improved epoxy composition is implemented as adhesives for manufacturing an anisotropic conductive film (ACF) and also for connecting, encapsulating, or packaging of electronic devices.
  • THERMOSETTING INK COMPOSITION
    申请人:Kimura Kazuya
    公开号:US20110247864A1
    公开(公告)日:2011-10-13
    The present invention provides a thermosetting ink composition having excellent balance concerning screen printability capable of preventing oozing and bleeding at the time of screen printing, electric insulating reliability and adhesion with an objective for coating. The thermosetting ink composition of the invention comprises a thermosetting resin (A) having a value “a” of less than 0.60 in the following formula (1) showing the relationship between the intrinsic viscosity [η] and the absolute molecular weight M of the resin: [η]=K×M a (1) wherein K is a constant number. Since the thermosetting ink composition can prevent oozing and bleeding at the time of screen printing and an excessive amount of a filler is not used for improving the printability, it can form excellent solder resists and other protective films at low coat without decreasing the electric insulating reliability and adhesion with an objective for coating.
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