The present invention relates to new types of metal complexes. Such compounds can be used as active components (=functional materials) in a series of different types of applications which can be classed within the electronics industry in the widest sense.
The inventive compounds are described by the structure 1 and the formulae (1) to (60).
本发明涉及新型
金属配合物。这些化合物可以作为活性成分(=功能材料)在广义的电子工业中的一系列不同类型的应用中使用。这些创新化合物由结构1和公式(1)至(60)描述。