SEALING AGENT FOR OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR ELEMENT
申请人:Sekisui Chemical Co., Ltd.
公开号:EP2159242A1
公开(公告)日:2010-03-03
An object of the present invention is to provide a highly transparent, heat-resistant and light-resistant sealing agent for an optical semiconductor which provides excellent adhesion, and is capable of stably maintaining its shape and preventing sedimentation of a phosphor when used to seal a light emitting device of an optical semiconductor device. A further object of the present invention is to provide an optical semiconductor device formed by using the sealing agent for an optical semiconductor device. The sealing agent for an optical semiconductor device, which comprises: a silicone resin having a cyclic ether-containing group in the molecular structure; a heat curing agent capable of reacting with the cyclic ether-containing group; and a fine particulate material of silicon oxide, and the sealing agent having a viscosity of 500 to 10,000 mPa·s measured by an E-type viscometer at 25°C at 5 rpm, a thixotropic value of 1.2 to 2.5 calculated by dividing a viscosity measured by the E-type viscometer at 25°C at 1 rpm by a viscosity measured at 10 rpm (viscosity at 1 rpm/viscosity at 10 rpm), and a minimum viscosity of 100 mPa·s or higher measured at 1s-1 in the temperature range of 25°C to a curing temperature by a parallel plate rheometer.
本发明的目的是提供一种高透明度、耐热性和耐光性的光学半导体密封剂,该密封剂具有优异的粘附性,在用于密封光学半导体器件的发光装置时,能够稳定地保持其形状并防止荧光粉沉淀。本发明的另一个目的是提供一种通过使用光半导体器件密封剂形成的光半导体器件。光学半导体器件用密封剂包括:分子结构中含有环醚基团的硅树脂;能与环醚基团反应的热固化剂;氧化硅细颗粒材料,密封剂在 25℃、5 转/分条件下用 E 型粘度计测量的粘度为 500 至 10,000 mPa-s,触变值为 1.2 至 2.5,计算方法是用 E 型粘度计在 25℃、1 转/分钟时测得的粘度除以 10 转/分钟时测得的粘度(1 转/分钟时的粘度/10 转/分钟时的粘度),以及用平行板流变仪在 25℃至固化温度范围内以 1s-1 测得的最小粘度为 100 mPa-s 或更高。