A high frequency band pass filter using a high frequency multilayered substrate is provided that does not experience interlayer shift during lamination, requires only a small number of printings, does not shrink during firing, avoids distortion in the shape, thickness and spacing of substrate internal patterns and in the location of the internal pattern of the discrete devices after dicing, is free from burr occurrence, is excellent in dicing efficiency during fabrication, is superior in product yield and cost, and has enhanced performance.
A high frequency band pass filter includes a dielectric block
2
of substantially rectangular prismatic shape having a plurality of through holes
5
formed from one surface thereof to another surface opposite the one surface and having metallizations formed on all outer surfaces except the one surface and all inner surfaces of the holes, and a dielectric multilayered substrate having a plurality of dielectric layers
3
a
-
3
f
and incorporating capacitors and/or inductors. The dielectric multilayered substrate is made of a resin multilayered substrate and the dielectric layers are made from a composite dielectric material composition including a ceramic dielectric material and a heat-resistant, low-dielectric polymeric material including one or more resins whose weight-average absolute molecular weight is at least 1,000 and wherein the sum of carbon atoms and hydrogen atoms is at least 99% of all atoms and some or all resin molecules have a chemical bond therebetween.
本发明提供了一种使用高频多层衬底的高频带通滤波器,该衬底在层压过程中不会发生层间偏移,只需少量印刷,在烧制过程中不会收缩,在切割后可避免衬底内部图案的形状、厚度和间距以及分立器件内部图案的位置发生变形,不会出现毛刺,在制造过程中切割效率极高,产品产量和成本更优,性能更强。
高频带通滤波器包括一个介质块
2
大体呈矩形棱柱形状,具有多个通孔
5
从其一个表面到与一个表面相对的另一个表面形成,并在除一个表面之外的所有外表面和孔的所有内表面形成
金属化,以及一个多层介质基板,该基板具有多个介质层
3
a
-
3
f
并包含电容器和/或电感器。电介质多层基板由
树脂多层基板制成,电介质层由复合电介质材料组合物制成,该组合物包括陶瓷电介质材料和耐热低电介质高分子材料,后者包括一种或多种
树脂,其重量-平均绝对分子量至少为 1,000,其中
碳原子和
氢原子之和至少占所有原子的 99%,部分或所有
树脂分子之间具有
化学键。