1-cyano-2-phenyl-1H-imidazole | 955997-84-9

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 1-cyano-2-phenyl-1H-imidazole
• 英文别名: 2-Phenylimidazole-1-carbonitrile
• CAS: 955997-84-9
• 化学式: C₁₀H₇N₃
• 分子量: 169.186
• InChiKey: UCCGHLMDDOUWAF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.8
• 重原子数：
  13
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  41.6
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• BISPHENOL HAVING FLUORENE SKELETON, METHOD FOR PRODUCING SAME, POLYARYLATE RESIN, (METH)ACRYLATE COMPOUND AND EPOXY RESIN WHICH ARE DERIVED FROM THE BISPHENOL
  申请人：TAOKA CHEMICAL CO., LTD.

  公开号：US20190055180A1

  公开（公告）日：2019-02-21

  Provided are a bisphenol represented by the general formula (1), a method for producing the bisphenol, and a polyarylate resin, a (meth)acrylate compound and an epoxy resin which are derived from the bisphenol. In the formula (1), R 1 to R 4 are the same or different, and each represent an alkyl group, an aryl group or a halogen atom, n 1 and n 2 are the same or different, and each represent an integer of 1 to 4, and k 1 to k 4 are the same or different, and each represent 0 or an integer of 1 to 4. When at least one of k 1 to k 4 is 2 or more, corresponding R 1 to R 4 may be the same or different.

  提供的是由通式（1）表示的双酚，一种生产双酚的方法，以及源自双酚的聚苯醚树脂、（甲基）丙烯酸酯化合物和环氧树脂。在式（1）中，R1至R4相同或不同，每个代表一个烷基、芳基或卤素原子，n1和n2相同或不同，每个代表1到4的整数，k1至k4相同或不同，每个代表0或1到4的整数。当k1至k4中至少有一个为2或更大时，相应的R1至R4可以相同或不同。
• FILLER COMPOSITION FOR SPACE BETWEEN LAYERS OF THREE-DIMENSIONAL INTEGRATED CIRCUIT, COATING FLUID, AND PROCESS FOR PRODUCING THREE-DIMENSIONAL INTEGRATED CIRCUIT
  申请人：Mitsubishi Chemical Corporation

  公开号：EP2631255A1

  公开（公告）日：2013-08-28

  To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit. An interlayer filler composition for a three-dimensional integrated circuit, which comprises a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s and a flux (B), the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A), or comprises a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s and a coefficient of thermal conductivity of at least 0.2 W/mK, an inorganic filler (C) having a coefficient of thermal conductivity of at least 2 W/mK, a volume average particle size of at least 0.1 µm and at most 5 µm and a maximum volume particle size of at most 10 µm, and a curing agent (D) and/or a flux (B).

  提供一种层间填料组合物，在半导体器件芯片的三维层压中，与焊料凸块或类似物的粘合同时形成高导热填料层，并在半导体器件芯片之间着地，还提供一种涂布液和一种生产三维集成电路的工艺。 一种用于三维集成电路的层间填充组合物，它包括在 120°C 时熔融粘度不超过 100 Pa-s 的树脂 (A) 和助焊剂 (B)，助焊剂 (B) 的含量至少为每 100 份树脂 (A) 0.1 份（按重量计），至多为 10 份（按重量计），或包括在 120°C 时熔融粘度不超过 100 Pa-s 的树脂 (A) 和导热系数至少为 0.2 W/mK 的树脂 (A)、导热系数至少为 2 W/mK 的无机填料 (C)、体积平均粒径至少为 0.1 微米且最多为 5 微米且最大体积粒径最多为 10 微米的无机填料 (C)，以及固化剂 (D) 和/或助焊剂 (B)。
• AGGREGATED BORON NITRIDE PARTICLES, COMPOSITION CONTAINING SAID PARTICLES, AND THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING LAYER COMPRISING SAID COMPOSITION
  申请人：Mitsubishi Chemical Corporation

  公开号：EP2786961A1

  公开（公告）日：2014-10-08

  To provide a composition for a three-dimensional integrated circuit capable of forming a filling interlayer excellent in thermal conductivity also in a thickness direction, using agglomerated boron nitride particles excellent in the isotropy of thermal conductivity, disintegration resistance and kneading property with a resin. A composition for a three-dimensional integrated circuit, comprising agglomerated boron nitride particles which have a specific surface area of at least 10 m2/g, the surface of which is constituted by boron nitride primary particles having an average particle size of at least 0.05 µm and at most 1 µm, and which are spherical, and a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s.

  为了提供一种用于三维集成电路的组合物，该组合物利用在导热性、抗崩解性和与树脂的捏合性方面具有优异各向同性的团聚氮化硼颗粒，能够形成在厚度方向上也具有优异导热性的填充夹层。 一种用于三维集成电路的组合物，包括比表面积至少为 10 m2/g 的团聚氮化硼颗粒，其表面由平均粒径至少为 0.05 µm、最多为 1 µm、呈球形的氮化硼初级颗粒构成；以及一种在 120°C 时熔融粘度最多为 100 Pa-s 的树脂 (A)。
• AGGLOMERATED BORON NITRIDE PARTICLES, COMPOSITION CONTAINING SAID PARTICLES, AND THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING LAYER COMPRISING SAID COMPOSITION
  申请人：Mitsubishi Chemical Corporation

  公开号：EP3269682A1

  公开（公告）日：2018-01-17

  A composition for a three-dimensional integrated circuit, comprising agglomerated boron nitride particles constituted by primary particles of hexagonal boron nitride crystals, wherein the primary particles of hexagonal boron nitride crystals are arranged in a normal direction so that their a-axes face outward.

  一种用于三维集成电路的组合物，包括由六方氮化硼晶体初级粒子构成的氮化硼颗粒团聚体，其中六方氮化硼晶体初级粒子沿法线方向排列，使其 a 轴朝外。
• PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
  申请人：Yazaki Corporation

  公开号：EP3863384A1

  公开（公告）日：2021-08-11

  A printed wiring board 10 includes a substrate 11 and wiring 12 provided on a surface of the substrate and including a cured conductive paste. The conductive paste contains metal nanoparticles having an average particle diameter of 30 nm or more and 600 nm or less, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. The wiring has a length of 100 mm or more and 1600 mm or less, a width of 0.3 mm or more and 3 mm or less, a thickness of 10 µm or more and 40 µm or less, and a resistance value of 1000 mΩ/m or less.

  印制电路板 10 包括基板 11 和基板表面的布线 12，其中包括固化导电浆料。导电膏含有平均颗粒直径大于等于 30 纳米且小于等于 600 纳米的金属纳米颗粒、平均颗粒直径大于金属纳米颗粒的金属颗粒、分子中含有环氧乙烷环的热固性树脂、固化剂和纤维素树脂。布线的长度为 100 毫米以上 1600 毫米以下，宽度为 0.3 毫米以上 3 毫米以下，厚度为 10 微米以上 40 微米以下，电阻值为 1000 mΩ/m 以下。