申请人:Aiba Akihiro
公开号:US20070157845A1
公开(公告)日:2007-07-12
A problem for the present invention is to provide a surface-treating agent which improves heat resistance, adhesiveness to resin and solder wettability.
This problem is solved by a surface-treating agent for metal comprising a tetrazole derivative represented by the following general formula and/or a salt thereof.
(wherein R
1
and R
2
each independently represent a hydrogen atom, a halogen atom, or an alkyl group or an aryl group, etc., which each have a carbon number of not more than 10, and a group having a halogen atom, a hydroxyl group, a carboxyl group, an amino group or a mercapto group added thereto, or represent an amino group, a mercapto group, a hydroxyl group or a carboxyl group; and R
3
represents a bond or an alkylene group, etc., which each have a carbon number of not more than 10, and a group having a halogen atom, a hydroxyl group, a carboxyl group, an amino group, a mercapto group, an azo group (—N═N—), a sulfide group (—S—), or a disulfide group (—S—S—) added thereto, or represents an azo group, a sulfide group, or disulfide group).
The surface-treating agent may contain a metal or metal compound.