2,6-diacetoxymethylphenol | 109129-38-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,6-diacetoxymethylphenol
• 英文别名: 2,6-Bis-acetoxymethyl-4-methyl-phenol；(2-Hydroxy-5-methyl-1,3-phenylene)bis(methylene) diacetate；[3-(acetyloxymethyl)-2-hydroxy-5-methylphenyl]methyl acetate
• CAS: 109129-38-6
• 化学式: C₁₃H₁₆O₅
• 分子量: 252.267
• InChiKey: JOFSEHHMYPDWFR-UHFFFAOYSA-N

物化性质

• 熔点：
  35-36 °C
• 沸点：
  348.5±37.0 °C(Predicted)
• 密度：
  1.202±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  18
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.38
• 拓扑面积：
  72.8
• 氢给体数：
  1
• 氢受体数：
  5

反应信息

• 作为反应物：
  描述：

  2,6-diacetoxymethylphenol 、 邻氨基苯乙酮 、 对氯苯异氰酸酯 在 三氟甲磺酸 作用下， 以 甲苯 为溶剂， 反应 10.0h， 以68%的产率得到(3'-(4-chlorophenyl)-6-methyl-2'-oxo-2',3'-dihydro-1'Hspiro[chroman-2,4'-quinazolin]-8-yl)methyl acetate
  参考文献：
  名称：

  通过无金属、三组分、多米诺骨牌、双环结构构建色曼-螺喹唑啉（噻）酮骨架的合成方案

  摘要：

  描述了一种用于合成色满-螺喹唑啉（噻）酮的三组分多米诺骨牌方法。它涉及 2-氨基苯乙酮和异（硫）氰酸酯的缩合，然后与 2-羟基苯甲醇衍生物进行杂-Diels-Alder 环化。该反应在无金属催化条件下表现出广泛的底物范围。

  DOI：

  10.1002/adsc.202101324
• 作为产物：
  描述：

  2,6-双(溴甲基)-4-甲基苯酚 、 sodium acetate 在 溶剂黄146 作用下， 生成 2,6-diacetoxymethylphenol
  参考文献：
  名称：

  Vulcanization of butyl rubber by 2,6-di(acyloxymethyl)-4-hydrocarbyl phenols

  摘要：

  公开号：

  US02830970A1

文献信息

• DIAMINE COMPOUND, AND HEAT-RESISTANT RESIN OR HEAT-RESISTANT RESIN PRECURSOR USING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20170334837A1

  公开（公告）日：2017-11-23

  Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

  提供了一种具有优异图案加工性（高灵敏度和高分辨率）且在热处理后具有优异化学耐性和热耐性的光敏树脂组合物；用于该组合物的耐热树脂或耐热树脂前体；以及作为树脂和前体原料的二胺化合物。该二胺化合物是由通式（1）表示的二胺化合物。
• PHOTOSENSITIVE COMPOSITION, CURED FILM AND PRODUCTION PROCESS THEREOF, AND ELECTRONIC PART
  申请人：JSR CORPORATION

  公开号：US20140234777A1

  公开（公告）日：2014-08-21

  It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH 2 OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).

  本发明的目的是提高树脂组合物和光敏组合物的可固化性，适用于形成电子部件的表面保护膜和层间绝缘膜等，同时在组合物用于在基板上形成固化膜时减少基板中剩余的内部应力。光敏组合物包括具有酚羟基的树脂(A)，至少具有两个噁唑烷基的交联剂(B1)，至少具有两个由—CH2OR（其中R是氢原子，具有1至10个碳原子的烷基或乙酰基）表示的基团的交联剂(B2)和光敏酸发生剂(C)。
• POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE INCLUDING CURED FILM USING THE SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20150212412A1

  公开（公告）日：2015-07-30

  The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X 1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X 2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.

  本发明提供了一种正型光敏树脂组合物，能够获得低翘曲性的固化膜，并且在低于250℃的较低温度下烧结时具有高灵敏度和高分辨率。本发明揭示了一种正型光敏树脂组合物，包括（a）聚酰亚胺树脂，包括由一般式（1）表示的结构单元和由一般式（2）表示的结构单元，以及（b）喹喔啉二酮化合物。其中，聚酰亚胺树脂包括由一般式（1）表示的结构单元和由一般式（2）表示的结构单元，其酰亚胺化比例为85％或更高，并且一般式（1）表示的结构单元与一般式（2）表示的结构单元的比例在30:70至90:10的范围内，其中，一般式（1）中的X1表示包括1至4个芳香环的四羧酸残基，Y1表示包括1至4个芳香环的芳香二胺残基，一般式（2）中的X2表示包括1至4个芳香环的四羧酸残基，Y2表示主链中包含至少两个或更多的烷基二醇单元的二胺残基。
• Phenolic resins
  申请人：BORDEN (UK) LIMITED

  公开号：EP0377308A1

  公开（公告）日：1990-07-11

  A cured phenolic resin may be prepared by reacting (1) an esterified phenolic compound containing one or more phenolic hydroxyl groups and/or one or more esterified phenolic hydroxyl groups and further containing one or more esterified methylol groups ortho and/or para to the (esterified) phenolic hydroxyl group and (2) a phenolic resole resin in the presence of a base and water and/or other polar solvent. This technique may be used in the production of phenolic-based adhesives, foundry moulding compositions, surface coatings, foams and proppants.

  固化酚醛树脂可通过以下反应制备：(1) 含有一个或多个酚羟基和/或一个或多个酯化酚羟基并进一步含有与（酯化）酚羟基正交和/或对位的一个或多个酯化甲醇基的酯化酚化合物；(2) 在碱和水和/或其他极性溶剂存在下的酚醛再烯树脂。这种技术可用于生产酚基粘合剂、铸造成型组合物、表面涂层、泡沫和支撑剂。
• Photosensitive heat resistant resin precursor composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1388758A1

  公开（公告）日：2004-02-11

  A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1): R1 represents an alkyl group having a carbon number in the range of 1 to 3. R2, R3, R4, and R5 each represent hydrogen or an alkyl group having a carbon number in the range of 1 to 3, and 1 represents an integer in the range of 0 to 3.

  一种具有优异膜厚均匀性的光敏树脂前体组合物包含：一种耐热树脂前体聚合物；一种辐射敏感化合物；以及一种由式（1）表示的溶剂： R1 代表碳数在 1 至 3 之间的烷基。R2、R3、R4 和 R5 分别代表氢或碳原子数在 1 至 3 之间的烷基，1 代表 0 至 3 之间的整数。