The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin. The above laminate has a substrate and a plurality of resin insulating layers formed on the substrate, in which one of the plural resin insulating layers in contact with the substrate is a layer formed of the curable resin composition.
本发明提供了一种可固化
树脂组合物,可以在保持粘附性的同时提供优异的绝缘可靠性的固化材料,并提供用于形成焊盘阻焊层、干膜和印制电路板的组合物、具有优异的绝缘可靠性和粘附性的
树脂绝缘层的层压板、用于形成该层压板的干膜以及制备层压板的方法。可固化
树脂组合物包含(A)
咪唑-
异氰酸酯加合物,(B)含有羧基的
树脂和(C)热固性
树脂。上述层压板具有基板和形成在基板上的多个
树脂绝缘层,其中与基板接触的众多
树脂绝缘层之一是由可固化
树脂组合物形成的层。