Compounds are synthesized with bicyclic amidinate ligands attached to one or more metal atoms. These compounds are useful for the synthesis of materials containing metals. Examples include pure metals, metal alloys, metal oxides, metal nitrides, metal phosphides, metal sulfides, metal selenides, metal tellurides, metal borides, metal carbides, metal silicides and metal germanides. Techniques for materials synthesis include vapor deposition (chemical vapor deposition and atomic layer deposition), liquid solution methods (sol-gel and precipitation) and solid-state pyrolysis. Copper metal films are formed on heated substrates by the reaction of copper(I) bicyclic amidinate vapor and hydrogen gas, whereas reaction with water vapor produces copper oxide. Silver and gold films were deposited on surfaces by reaction of their respective bicyclic amidinate vapors with hydrogen gas. Reaction of cobalt(II) bis(bicyclic amidinate) vapor, ammonia gas and hydrogen gas deposits cobalt metal films on heated substrates, while reaction with ammonia produces cobalt nitride and reaction with water vapor produces cobalt oxide. Ruthenium metal films are deposited by reaction of ruthenium(II) bis(bicyclic amidinate) or ruthenium(III) tris(bicyclic amidinate) at a heated surface either with or without a co-reactant such as hydrogen gas or ammonia or oxygen. Suitable applications include electrical interconnects in microelectronics and magnetoresistant layers in magnetic information storage devices. Hafnium oxide films are deposited by reaction of hafnium(IV) tetrakis(bicyclic amidinate) with oxygen sources such as water, hydrogen peroxide or ozone. The HfO2 films have high dielectric constant and low leakage current, suitable for applications as an insulator in microelectronics. The films have very uniform thickness and complete step coverage in narrow holes.
双环脒基
配体与一个或多个
金属原子相连,合成出化合物。这些化合物可用于合成含有
金属的材料。例如纯
金属、
金属合
金、
金属氧化物、
金属
氮化物、
金属
磷化物、
金属
硫化物、
金属
硒化物、
金属
碲化物、
金属
硼化物、
金属
碳化物、
金属
硅化物和
金属
锗化物。材料合成技术包括气相沉积法(
化学气相沉积法和原子层沉积法)、液溶法(溶胶-凝胶法和沉淀法)和固态热解法。
金属
铜膜是通过
铜(I)双环脒蒸气和
氢气的反应在加热的基底上形成的,而与
水蒸气的反应则产生
氧化铜。
银和
金薄膜是通过各自的双环脒蒸气与
氢气反应沉积在表面上的。双环脒酸
钴(II)蒸气、
氨气和
氢气的反应可在加热的基底上沉积
钴金属膜,而与
氨气的反应可生成
氮化
钴,与
水蒸气的反应可生成
氧化钴。
钌金属膜是通过
钌(II)双(双环脒)或
钌(III)三(双环脒)在加热表面与或不与
氢气、
氨气或
氧气等共反应物反应沉积而成的。合适的应用包括微电子中的电气互连和磁性信息存储设备中的抗磁层。
氧化铪薄膜是通过
铪(IV)四(双环脒)与
水、
过氧化氢或
臭氧等
氧源反应沉积而成的。二
氧化铪薄膜具有高介电常数和低泄漏电流的特点,适合用作微电子领域的绝缘体。薄膜的厚度非常均匀,在窄孔中具有完整的阶跃覆盖。