申请人:HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
公开号:US20150337116A1
公开(公告)日:2015-11-26
A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R
1
is a tetravalent organic group, R
2
is a divalent organic group and R
3
and R
4
are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond. R
5
is an alkyl group having 1 to 4 carbon atoms, R
6
is independently a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, a is an integer of 0 to 3, n is an integer of 1 to 6, and R
7
is a group represented by the following general formula (3) or (4): wherein in the formula (3) or (4), R
8
is an alkyl group having 1 to 10 carbon atoms or a monovalent organic group derived from hydroxyalkylsilane and R
9
is an alkyl group having 1 to 10 carbon atoms, a monovalent organic group derived from aminoalkylsilane or a heterocyclic group, and R
8
and R
9
may independently have a substituent.