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2,2-Dimethyl-buttersaeure-pentylester | 14114-19-3

中文名称
——
中文别名
——
英文名称
2,2-Dimethyl-buttersaeure-pentylester
英文别名
α,α-Dimethylbuttersaeure-n-amylester;α.α-Dimethyl-buttersaeure-amylester;2,2-dimethyl-butyric acid pentyl ester;Pentyl 2,2-dimethylbutanoate
2,2-Dimethyl-buttersaeure-pentylester化学式
CAS
14114-19-3
化学式
C11H22O2
mdl
——
分子量
186.294
InChiKey
QHOOAZOPYJNMRU-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    3.7
  • 重原子数:
    13
  • 可旋转键数:
    7
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.91
  • 拓扑面积:
    26.3
  • 氢给体数:
    0
  • 氢受体数:
    2

反应信息

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文献信息

  • PHOTORESIST COMPOSITIONS AND METHODS
    申请人:Rohm and Haas Electronic Materials Korea Ltd.
    公开号:US20170090283A1
    公开(公告)日:2017-03-30
    New photoresists are provided that are useful in a variety of applications, including negative-tone development processes. Preferred resists comprise a first polymer comprising first units comprising a reactive nitrogen-containing moiety spaced from the polymer backbone, wherein the nitrogen-containing moiety produces a basic cleavage product during lithographic processing of the photoresist composition.
    提供了新的光阻剂,可用于各种应用,包括负调色剂开发过程。首选光阻剂包括第一聚合物,其中包括与聚合物骨架间隔的含有反应性氮基团的第一单元,其中氮基团在光刻处理光阻剂组合物期间产生碱性裂解产物。
  • OVERCOAT COMPOSITIONS AND METHODS FOR PHOTOLITHOGRAPHY
    申请人:Rohm and Haas Electronic Materials Korea Ltd.
    公开号:US20170090287A1
    公开(公告)日:2017-03-30
    Topcoat compositions are provided that are suitably applied above a photoresist composition. Preferred topcoat compositions comprise a first polymer comprising first units comprising a reactive nitrogen-containing moiety spaced from the polymer backbone, wherein the nitrogen-containing moiety produces a basic cleavage product during lithographic processing of the photoresist composition.
    提供了适合应用在光阻剂组合物上方的面漆组合物。首选的面漆组合物包括第一聚合物,其中第一单元包括与聚合物主链相距的含反应性氮基团,氮基团在光刻加工光阻剂组合物时产生碱性裂解产物。
  • Shape memory polymers
    申请人:Anthamatten Mitchell L.
    公开号:US20080177303A1
    公开(公告)日:2008-07-24
    The present disclosure relates to Shape Memory Polymers (SMP's) comprising function groups that allow the polymers to be elastically deformed, utilized in the elastically deformed state, and subsequently returned to the original polymorphic shape.
    本公开涉及形状记忆聚合物(SMP),其中包含允许聚合物弹性变形的功能基团,可在弹性变形状态下使用,并随后返回到原始的多态形状。
  • LASER-DECOMPOSABLE RESIN COMPOSITION AND PATTERN-FORMING MATERIAL USING THE SAME
    申请人:SUGASAKI Atsushi
    公开号:US20080038663A1
    公开(公告)日:2008-02-14
    A laser-decomposable resin composition contains: a compound including at least one structure selected from a carboxyl group and a carboxylic acid anhydride structure and at least one hetero atom selected from N, S and O atoms other than the structure; and a binder polymer.
    一种可激光分解的树脂组合物,包括:一种化合物,其中包括至少一种结构,所述结构从羧基和羧酸酐结构中选择至少一种,并且还包括至少一种异原子,所述异原子选自N、S和O原子以外的结构;以及一种粘合剂聚合物。
  • Shape Memory Polymers
    申请人:Anthamatten Mitchell L.
    公开号:US20110251364A1
    公开(公告)日:2011-10-13
    The present disclosure relates to Shape Memory Polymers (SMP's) comprising function groups that allow the polymers to be elastically deformed, utilized in the elastically deformed state, and subsequently returned to the original polymorphic shape.
    本公开涉及具有功能基团的形状记忆聚合物(SMP),这些功能基团使聚合物能够弹性变形,在弹性变形状态下使用,并随后返回到原始的多形态形状。
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