bis(4-ethyl-3,3',5,5'-tetramethyldipyrroylmethenate)copper(II) | 265298-20-2

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯
• 英文名称: bis(4-ethyl-3,3',5,5'-tetramethyldipyrroylmethenate)copper(II)
• CAS: 265298-20-2
• 化学式: C₃₀H₃₈CuN₄
• 分子量: 518.205
• InChiKey: PMXIUUKMOIDOIZ-WCKRPDPUSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  None
• 重原子数：
  None
• 可旋转键数：
  None
• 环数：
  None
• sp3杂化的碳原子比例：
  None
• 拓扑面积：
  None
• 氢给体数：
  None
• 氢受体数：
  None

反应信息

• 作为反应物：
  描述：

  bis(4-ethyl-3,3',5,5'-tetramethyldipyrroylmethenate)copper(II) 以 solid 为溶剂， 生成 氮 、 copper(II) oxide
  参考文献：
  名称：

  Thermal properties of ligands, salts and metal complexes of linear oligopyrroles

  摘要：

  The effect of structure on the thermal properties of dipyrrolylmethanes, dipyrrolylmethenes, bis (dipyrrolylmethenes), their salts, and chelates is analyzed proceeding from the results of thermogravimetric analysis. The common tendency is a decrease in the thermal stability of compounds with a disturbed symmetry of alkyl substitution of ligands and with a higher degree of their alkylation, with the increased size of alkyl substituents, with the nitrogen atom in the five-member cycles replaced by S or O. The opposite effect occurs at the change in the mode of attaching methylene spacer in going from 2,2'- to 3,3'-bis(dipyrrolylmethenes). The effects of the themostabilization of the ligands of linear oligopyrroles in the composition of chelates and HBr salts are evaluated quantitatively.

  DOI：

  10.1134/s1070363209090163