Remarkably Volatile Copper(II) Complexes of N,N‘-Unsymmetrically Substituted 1,3-Diketimines as Precursors for Cu Metal Deposition via CVD or ALD
摘要:
To enhance the volatility of the copper precursor in the copper deposition process, it was envisioned that N,N'-unsymmetrically substituted 1,3-diketimines should be more volatile than their symmetrically substituted counterparts. A variety of Cu(II) (N,N'-unsymmetrically substituted 1,3-diketiminate) complexes have been synthesized and have proven to be much more volatile than their symmetrical counterparts. This makes the new materials particularly attractive to the ALD and CVD processes. Among the new compounds, 8-a and 8-b are sublimable even at room temperature.
Copper (II) Complexes for Deposition of Copper Films by Atomic Layer Deposition
申请人:Bradley Alexander Zak
公开号:US20080044687A1
公开(公告)日:2008-02-21
The present invention relates to novel 1,3-diimines and 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an atomic layer deposition process.
Copper (I) Complexes for Deposition of Copper Films by Atomic Layer Deposition
申请人:Alexander Zak Bradley
公开号:US20080299322A1
公开(公告)日:2008-12-04
The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.
Routes to <i>N</i>,<i>N</i>‘-Unsymmetrically Substituted 1,3-Diketimines
作者:Kyung-Ho Park、Will J. Marshall
DOI:10.1021/jo047798f
日期:2005.3.1
[GRAPHICS]A series of novel N,N'-unsymmetrically substituted 1,3-diketimines (3, 12, and 27) have been synthesized from the reaction of exocyclic enaminoketones 8 with amines or metalloenamines (from 13 or 14) with imidoyl thioether 25 or 26.
COPPER (II) COMPLEXES FOR DEPOSITION OF COPPER FILMS BY ATOMIC LAYER DEPOSITION
申请人:E.I. du Pont de Nemours and Company
公开号:EP1771595A1
公开(公告)日:2007-04-11
COPPER (I) COMPLEXES FOR DEPOSITION OF COPPER FILMS BY ATOMIC LAYER DEPOSITION