[EN] SURFACE TREATING AGENT FOR COPPER OR COPPER ALLOY AND USE THEREOF<br/>[FR] AGENT DE TRAITEMENT DE SURFACE POUR CUIVRE OU ALLIAGE DE CUIVRE ET SON UTILISATION
申请人:SHIKOKU CHEM
公开号:WO2010016620A1
公开(公告)日:2010-02-11
A surface treating agent for copper or a copper alloy, which contains an imidazole compound represented by the formula (I): wherein R represents a hydrogen atom or an alkyl group, X1 and X2 are the same or different and represent a chlorine atom or a bromine atom; m and n represent an integer of 0 to 3 and at least one of m or n is 1 or more. The surface treating agent is also used in surface treating methods, in making printed wiring boards and in soldering methods.