Positive photosensitive resin compositions, which comprise (A) a polyamidate having repetitive units of general formula (I)
wherein R1 is a tetravalent organic group, R2 is a divalent organic group having a phenolic hydroxyl group, three R3 groups and three R4 groups each independently are an alkyl group or a hydrogen atom, and at least two R3 groups and at least two R4 groups are alkyl groups,
and (B) a compound capable of generating an acid when exposed to light, are improved in storage stability and exposure sensitivity to i-line. Such compositions can improve the reliability of electronic parts when formed into surface-protecting films or interlayer insulating films by a method including exposure to i-line, development and heating.
阳性光敏
树脂组合物,它包括 (A) 具有通式(I)重复单元的聚酰胺化合物
其中 R1 为四价有机基团,R2 为具有
酚羟基的二价有机基团,三个 R3 基团和三个 R4 基团各自独立地为烷基或氢原子,且至少两个 R3 基团和至少两个 R4 基团为烷基、
和 (B) 在光照下能生成酸的化合物,其贮存稳定性和光照敏感性均得到改善。当采用包括 i-线曝光、显影和加热的方法将此类组合物制成表面保护膜或层间绝缘膜时,可提高电子零件的可靠性。