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4-[3-(2,3,4-Trihydroxyphenyl)propyl]benzene-1,2,3-triol | 10550-61-5

中文名称
——
中文别名
——
英文名称
4-[3-(2,3,4-Trihydroxyphenyl)propyl]benzene-1,2,3-triol
英文别名
——
4-[3-(2,3,4-Trihydroxyphenyl)propyl]benzene-1,2,3-triol化学式
CAS
10550-61-5
化学式
C15H16O6
mdl
——
分子量
292.288
InChiKey
KSDBQJJQCLDPBY-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2.5
  • 重原子数:
    21
  • 可旋转键数:
    4
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.2
  • 拓扑面积:
    121
  • 氢给体数:
    6
  • 氢受体数:
    6

文献信息

  • Photosensitive polymer composition, method for forming relief patterns, and electronic parts
    申请人:Hitachi Chemical DuPont MicroSystems Ltd.
    公开号:EP0961169A1
    公开(公告)日:1999-12-01
    Disclosed are a photosensitive polymer composition comprising (a) a polymer soluble in an aqueous alkaline solution, (b) an o-quinonediazide compound, and (c) a dissolution inhibitor for the component (a) in an aqueous alkaline solution; a method of using the composition for forming relief patterns; and electronic parts having, as a passivating film or an interlayer insulating film, the relief pattern as formed in the method. The composition has high sensitivity, and gives fine relief patterns having a good profile.
    本发明公开了一种光敏聚合物组合物,该组合物包含:(a) 可溶于碱性溶液的聚合物;(b) 邻醌噻嗪化合物;(c) 成分(a)在碱性溶液中的溶解抑制剂;使用该组合物形成浮雕图案的方法;以及电子零件,该电子零件具有在该方法中形成的浮雕图案,作为钝化膜或层间绝缘膜。该组合物具有高灵敏度,可形成具有良好轮廓的精细浮雕图案。
  • Positive photosensitive resin composition, method of forming relief pattern, and electronic part
    申请人:Hitachi Chemical DuPont MicroSystems Ltd.
    公开号:EP1028354A1
    公开(公告)日:2000-08-16
    Positive photosensitive resin compositions, which comprise (A) a polyamidate having repetitive units of general formula (I) wherein R1 is a tetravalent organic group, R2 is a divalent organic group having a phenolic hydroxyl group, three R3 groups and three R4 groups each independently are an alkyl group or a hydrogen atom, and at least two R3 groups and at least two R4 groups are alkyl groups, and (B) a compound capable of generating an acid when exposed to light, are improved in storage stability and exposure sensitivity to i-line. Such compositions can improve the reliability of electronic parts when formed into surface-protecting films or interlayer insulating films by a method including exposure to i-line, development and heating.
    阳性光敏树脂组合物,它包括 (A) 具有通式(I)重复单元的聚酰胺化合物 其中 R1 为四价有机基团,R2 为具有羟基的二价有机基团,三个 R3 基团和三个 R4 基团各自独立地为烷基或氢原子,且至少两个 R3 基团和至少两个 R4 基团为烷基、 和 (B) 在光照下能生成酸的化合物,其贮存稳定性和光照敏感性均得到改善。当采用包括 i-线曝光、显影和加热的方法将此类组合物制成表面保护膜或层间绝缘膜时,可提高电子零件的可靠性。
  • PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART
    申请人:Hitachi Chemical DuPont Microsystems Ltd.
    公开号:EP1708026A1
    公开(公告)日:2006-10-04
    A photosensitive polymer composition includes (a) a polyamide having a repeating unit represented by the following general formula (I): wherein U represents a tetravalent organic group, V represents a bivalent organic group and p is an integer representing a number of the repeating unit; (b) a compound which generates an acid upon receiving light; and (c) a compound represented by the following general formula (II): wherein m and n are each independently integer of 1 or 2, Rs are each independently hydrogen, alkyl group or acyl group, and R1 and R2 each independently represents fluoroalkyl group having 1 to 3 carbon atoms.
    一种光敏聚合物组合物包括 (a) 聚酰胺,其重复单元由以下通式 (I) 表示: 其中 U 代表四价有机基团,V 代表二价有机基团,p 是代表重复单元数目的整数;(b) 在接受光照时产生酸的化合物;和 (c) 由以下通式(II)代表的化合物: 其中 m 和 n 各自独立地为 1 或 2 的整数,Rs 各自独立地为氢、烷基或酰基,R1 和 R2 各自独立地代表具有 1 至 3 个碳原子的氟烷基。
  • METHOD FOR PRODUCING POLYIMIDE FILM, POLYIMIDE FILM, POLYAMIDE ACID SOLUTION AND PHOTOSENSITIVE COMPOSITION
    申请人:Tokyo Ohka Kogyo Co., Ltd.
    公开号:EP3406657A1
    公开(公告)日:2018-11-28
    A method for producing a polyimide film, comprising the steps of: obtaining a polyamic acid solution having a viscosity of 5 to 150 cps by preparing a raw material mixture liquid that contains a solvent, a tetracarboxylic dianhydride represented by a specific general formula, and an aromatic diamine represented by a specific general formula, and that has a total content of the tetracarboxylic dianhydride and the aromatic diamine of 15% by mass or less, and reacting the tetracarboxylic dianhydride and the aromatic diamine with each other in the raw material mixture liquid to form a polyamic acid having a repeating unit represented by a specific general formula; obtaining a polyimide-forming mixture liquid by adding a compound represented by a specific general formula to the polyamic acid solution; and obtaining a film made of a polyimide represented by a specific general formula by forming a film made of the polyimide-forming mixture liquid, followed by imidization of the polyamic acid in the film.
    一种生产聚酰亚胺薄膜的方法,包括以下步骤通过制备含有溶剂、特定通式表示的四羧酸二酐和特定通式表示的芳香族二胺的 原料混合物液体,获得粘度为 5 至 150 cps 的聚酰胺酸溶液、将原料混合物液体中的四羧酸二酐和芳香族二胺相互反应,生成具有特定通式所代表重复单元的聚酰胺;在聚酰胺溶液中加入特定通式表示的化合物,得到聚酰亚胺形成混合物液体;以及 利用聚酰亚胺形成混合物液体形成薄膜,然后将薄膜中的聚酰胺酰亚胺化,得到由特定通式表示的聚酰亚胺制成的薄膜。
  • Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component
    申请人:Hitachi Chemical Co., Ltd.
    公开号:US10175577B2
    公开(公告)日:2019-01-08
    The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.
    本发明提供了一种光敏树脂组合物,包括(A)具有羟基的碱溶性树脂、(B)在光照下产生酸的化合物和(C)具有与组分(A)交联的基团的丙烯酸树脂,以及制造图案化固化薄膜的方法和用其制备的电子元件。
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