4-Butan-2-yl-2-methyl-1,3-thiazole | 1566458-63-6

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 4-Butan-2-yl-2-methyl-1,3-thiazole
• CAS: 1566458-63-6
• 化学式: C₈H₁₃NS
• 分子量: 155.26
• InChiKey: WUZNATZWZNKWBO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.9
• 重原子数：
  10
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.62
• 拓扑面积：
  41.1
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• P2X3 Receptor Antagonists for Treatment of Pain
  申请人：Burgey Christopher S.

  公开号：US20120064181A1

  公开（公告）日：2012-03-15

  The subject invention relates to novel P2X3 receptor antagonists that play a critical role in treating disease states associated with pain, in particular peripheral pain, inflammatory pain, or tissue injury pain that can be treated using a P2X3 receptor subunit modulator.

  本发明涉及新型P2X3受体拮抗剂，其在治疗与疼痛有关的疾病状态，特别是外周疼痛、炎性疼痛或组织损伤疼痛方面发挥关键作用，这些疼痛可以使用P2X3受体亚单位调节剂进行治疗。
• P2X3 RECEPTOR ANTAGONISTS FOR TREATMENT OF PAIN
  申请人：Burgey Christopher S

  公开号：US20100266714A1

  公开（公告）日：2010-10-21

  The subject invention relates to novel P2X 3 receptor antagonists that play a critical role in treating disease states associated with pain, in particular peripheral pain, inflammatory pain, or tissue injury pain that can be treated using a P2X 3 receptor subunit modulator.

  本发明涉及一种新型的P2X3受体拮抗剂，它在治疗与疼痛有关的疾病状态中发挥关键作用，特别是可以使用P2X3受体亚单位调节剂治疗的外周疼痛、炎性疼痛或组织损伤疼痛。
• HETEROCYCLIC COMPOUNDS AND USES THEREOF
  申请人：Castro Alfredo C.

  公开号：US20130029984A1

  公开（公告）日：2013-01-31

  Compounds and pharmaceutical compositions that modulate kinase activity, including PI3 kinase activity, and compounds, pharmaceutical compositions, and methods of treatment of diseases and conditions associated with kinase activity, including PI3 kinase activity, are described herein.

  本文描述了调节激酶活性（包括PI3激酶活性）的化合物和药物组合物，以及与激酶活性（包括PI3激酶活性）相关的疾病和病况的治疗方法、化合物和药物组合物。
• EPOTHILONE COMPOUNDS, PREPARATION METHOD AND USE THEREOF
  申请人：Tang, Li

  公开号：EP2514752B1

  公开（公告）日：2018-01-31
• SPIROHEPTANE SALICYLAMIDES AND RELATED COMPOUNDS AS INHIBITORS OF ROCK
  申请人：Bristol-Myers Squibb Company

  公开号：EP3402790B1

  公开（公告）日：2021-10-06