The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.
本公开涉及一种用于粘接半导体的粘合剂
树脂组合物,包括:热塑性
树脂;热固性
树脂;固化剂;和具有特定结构的化合物,以及包括该组合物的半导体粘合膜。