hexadecanedioic acid dihydrazide | 76656-74-1

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: hexadecanedioic acid dihydrazide
• 英文别名: Hexadecandisaeure-dihydrazid；Hexadecanedihydrazide
• CAS: 76656-74-1
• 化学式: C₁₆H₃₄N₄O₂
• 分子量: 314.472
• InChiKey: PJPRFQPMDKJMRW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.6
• 重原子数：
  22
• 可旋转键数：
  15
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.88
• 拓扑面积：
  110
• 氢给体数：
  4
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  hexadecanedioic acid dihydrazide 在 盐酸 、 sodium nitrite 作用下， 生成 1,14-diisocyanatotetradecane
  参考文献：
  名称：

  Iwakura et al., Nippon Kagaku Zasshi, 1957, vol. 78, p. 1504

  摘要：

  DOI：
• 作为产物：
  描述：

  壬二酸 在 盐酸 、 甲醇 、 乙醇 、 sodium 、 一水合肼 作用下， 生成 hexadecanedioic acid dihydrazide
  参考文献：
  名称：

  Iwakura et al., Nippon Kagaku Zasshi, 1957, vol. 78, p. 1504

  摘要：

  DOI：

文献信息

• Liquid crystal sealing agent and liquid crystalline display cell using the same
  申请人：Imaizumi Masahiro

  公开号：US20060208219A1

  公开（公告）日：2006-09-21

  The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 μm.

  本发明涉及一种密封剂，用于液晶，具有极低的对液晶的污染性，对基底具有优异的涂覆性和粘结性，具有长久的使用寿命和潜伏期，以及高粘接强度。本发明的液晶密封剂的特点在于包括(a)由通式(1)表示的环氧树脂：(其中a表示2到4的整数；n表示0到3（平均值）；R表示2到6个碳原子的二价碳氢基团；A表示多价芳香基团；G表示环氧基团，但当n为0时，(a)由通式(1)表示的环氧树脂为双酚S型)；(b)热固化剂；(c)和平均粒径不大于3μm的填料。
• Radiation Curable Resin, Liquid Crystal Sealing Material, and Liquid Crystal Display Cell Using Same
  申请人：Imaizumi Masahiro

  公开号：US20080305707A1

  公开（公告）日：2008-12-11

  [Problems] To provide a radiation curable resin having an extremely low possibility of contaminating liquid crystals, and a liquid crystal sealing material using such a photopolymerization initiator. [Means for Solving Problems] A liquid crystal sealing material characterized by comprising (a) a radiation curable resin represented by the general formula (1) below, (b) a photopolymerization initiator and (c) a filler having an average particle diameter of not more than 3 μm. (In the formula (1), R1 represents a hydrogen atom or a methyl group; R2 may be the same or different and represents a hydrogen atom, a halogen atom, a hydroxyl group, a monovalent linear, branched or cyclic alkyl group having 1-10 carbon atoms or an alkoxy group having 1-10 carbon atoms; m represents an integer of 1-4; R3 represents a hydrogen atom or a methyl group; R4 represents a linear, branched or cyclic alkyl group having 1-10 carbon atoms; 1 represents a range of positive numbers from 1 to 5; and the repeating unit number n represents a range of positive numbers from 0 to 20.)

  [问题]提供一种具有极低液晶污染可能性的辐射可固化树脂，以及使用这种光聚合引发剂的液晶密封材料。 [解决问题的方法]液晶密封材料的特征在于包括(a)由下式表示的辐射可固化树脂(1)，(b)光聚合引发剂和(c)平均粒径不超过3μm的填料。 (在式(1)中，R1表示氢原子或甲基基; R2可以相同或不同，表示氢原子、卤素原子、羟基、具有1-10个碳原子的单价线性、支链或环状烷基或具有1-10个碳原子的烷氧基; m表示1-4的整数; R3表示氢原子或甲基基; R4表示具有1-10个碳原子的线性、支链或环状烷基; 1表示1-5的正数范围; 重复单元数n表示0-20的正数范围。)
• (METH)ACRYLATE POLYMER, A RESIN COMPOSITION AND A SHAPED ARTICLE
  申请人：Wakita Tsuneki

  公开号：US20120123023A1

  公开（公告）日：2012-05-17

  Disclosed is a (meth)acrylate polymer having a volume average primary particle size of 0.520 to 3.00 μm, a peak temperature of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of −40° C. or below, a peak height of tan δ in the range of −100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more, and an acetone-insoluble component of 99% by mass of more. This polymer has excellent dispersibility of primary particles in a resin, excellent storage stability of a resin composition obtained, and excellent insulating properties and reduction in elastic modulus of a molded article obtained.

  本发明涉及一种（甲基）丙烯酸酯聚合物，其体积平均主粒子大小为0.520至3.00μm，tanδ在−100至0℃范围内的峰值温度，通过动态粘弹性测量确定为−40℃或更低，tanδ在−100至0℃范围内的峰值高度，通过动态粘弹性测量确定为0.300或更高，且丙酮不溶组分为质量的99%以上。该聚合物具有在树脂中主粒子的优异分散性，所得树脂组合物的优异储存稳定性，以及所得成型品的优异绝缘性和弹性模量降低。
• Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives
  申请人：HE HOLDINGS, INC. dba HUGHES ELECTRONICS

  公开号：EP0754741A2

  公开（公告）日：1997-01-22

  A flexible thermally-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) a thermally-conductive filler. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks or even months at room temperature and is curable in less than one hour at a temperature ranging from about 100°C to 140°C, whereupon the cured adhesive composition exhibits a durometer Shore A of less than about 90 and a thermal conductivity exceeding 0.4 BTU/hr-ft-°F (0.7 W/m-K).

  提供了一种柔性导热环氧基粘合剂组合物及其制造方法。本粘合剂组合物包括：(a) 聚合物混合物，该混合物包含至少一种聚环氧树脂，该树脂在用一定量的二乙三胺（"DETA"）和一定量的至少一种潜伏环氧树脂固化剂固化时，硬度不超过硬度计 Shore D 读数约 45；(b) 热导性填料。可选成分包括辅助环氧树脂、非反应性柔顺剂、稀释剂和加工助剂。本粘合剂组合物在室温下具有数周甚至数月的流变稳定性，并可在约 100°C 至 140°C 的温度下在一小时内固化，固化后的粘合剂组合物的硬度计邵氏 A 值小于约 90，导热系数超过 0.4 BTU/hr-ft-°F (0.7 W/m-K)。
• Flexible electrically-conductive epoxy adhesives
  申请人：HE HOLDINGS, INC. dba HUGHES ELECTRONICS

  公开号：EP0759462A2

  公开（公告）日：1997-02-26

  A flexible electrically-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore A reading of 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) an electrically-conductive filler comprising a metal. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks as a single component mixture at room temperature and is curable in less than two hours at a temperature ranging from about 100°C to 140°C, whereupon the cured adhesive composition exhibits a durometer Shore A of less than 95 and a volume resistivity less than about 10-2 ohm-cm at room temperature.

  提供了一种柔性导电环氧基粘合剂组合物及其制造方法。本粘合剂组合物包括：(a) 聚合物混合物，其中包含至少一种聚环氧树脂，在用一定量的二乙三胺（"DETA"）和一定量的至少一种潜伏环氧树脂固化剂固化时，其硬度不超过硬度计 Shore A 读数 45；(b) 导电填料，其中包含一种金属。可选成分包括辅助环氧树脂、非反应性柔顺剂、稀释剂和加工助剂。本粘合剂组合物在室温下作为单组分混合物具有数周的流变稳定性，并可在约 100°C 至 140°C 的温度下在两小时内固化，固化后的粘合剂组合物在室温下的硬度计邵氏 A 值小于 95，体积电阻率小于约 10-2 欧姆-厘米。