5-Methyl-2-phenyl-1H-imidazol-4-ol | 112240-31-0

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 5-Methyl-2-phenyl-1H-imidazol-4-ol
• CAS: 112240-31-0
• 化学式: C₁₀H₁₀N₂O
• 分子量: 174.2
• InChiKey: ZRSCAJHLPIPKBU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.1
• 重原子数：
  13
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.1
• 拓扑面积：
  48.9
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, INSULATING RESIN SHEET, AND PROCESS FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
  申请人：Endo Tadasuke

  公开号：US20100227170A1

  公开（公告）日：2010-09-09

  Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R 1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another.

  本发明公开了一种环氧树脂组合物，其基本包含(A)一种由通式（1）表示的结构具有的环氧树脂，(B)一种固化剂，(C)一种无机填料和(D)一种氰酸酯树脂和/或其预聚物，其中Ar代表融合芳香族碳氢基团；r是1或更多的整数；X是氢或环氧基（环氧乙烷基）；R1代表从氢、甲基、乙基、丙基、丁基、苯基和苄基组成的群体中选择的一种；n是1或更多的整数；p和q是1或更多的整数；在各自的重复单元中，p和q可以相同也可以不同。
• Resin composition for molding material
  申请人：DAINIPPON INK AND CHEMICALS, INC.

  公开号：EP0166275A2

  公开（公告）日：1986-01-02

  A resin composition for a molding material is provided which comprises a resol-type phenolic resin, an epoxy resin and an amine compound having hydrogen atoms directly bonded to the nitrogen atom. The amine compound is contained in such a proportion that the amount of its hydrogen atoms directly bonded to the nitrogen atom is 0.5 to 2.0 equivalents per equivalent of the epoxy groups of the epoxy resin.

  本发明提供了一种用于模塑材料的树脂组合物，该组合物由一种分解型酚醛树脂、一种环氧树脂和一种氢原子直接键合在氮原子上的胺化合物组成。胺化合物的含量比例为环氧树脂的环氧基团每当量含 0.5 至 2.0 个直接与氮原子结合的氢原子。
• SEMICONDUCTOR DEVICE
  申请人：Sumitomo Bakelite Company, Ltd.

  公开号：EP1956648A1

  公开（公告）日：2008-08-13

  The invention offers technology for suppressing damage to semiconductor devices due to temperature changes. When flip-chip mounting a silicon chip on a buildup type multilayer substrate having a structure with a thinned core, a core having a small coefficient of thermal expansion is used in the multilayer substrate, and the coefficient of thermal expansion and glass transition point of the underfill are appropriately designed in accordance with the thickness and coefficient of thermal expansion of the core. By doing so, it is possible to relieve stresses inside the semiconductor package caused by deformation of the multilayer substrate due to temperature changes, and thereby to suppress damage to the semiconductor package due to temperature changes.

  本发明提供了抑制温度变化对半导体器件造成损坏的技术。在将硅芯片倒装到具有减薄芯结构的堆积型多层衬底上时，在多层衬底中使用热膨胀系数小的芯，并根据芯的厚度和热膨胀系数适当设计底部填充物的热膨胀系数和玻璃化转变点。这样，就可以缓解多层衬底因温度变化而变形所造成的半导体封装内部的应力，从而抑制半导体封装因温度变化而损坏。
• ADHESIVE TAPE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP2011844A1

  公开（公告）日：2009-01-07

  An adhesive tape electrically connecting conductive members contains a resin, a solder powder and a curing agent having flux activity, wherein the solder powder and the curing agent having flux activity are contained in the resin.

  一种用于导电部件电气连接的胶带包含树脂、焊料粉末和具有助焊剂活性的固化剂，其中焊料粉末和具有助焊剂活性的固化剂包含在树脂中。
• ADHESIVE TAPE, JOINT STRUCTURE, AND SEMICONDUCTOR PACKAGE
  申请人：Sumitomo Bakelite Company, Ltd.

  公开号：EP2055756A1

  公开（公告）日：2009-05-06

  An adhesive tape 101 electrically connecting conductive components includes a resin layer 132 containing a thermosetting resin, a solder powder 103 and a curing agent. The solder powder 103 and the curing agent reside in the resin layer 132, the curing temperature T1 of the resin layer 132 and the melting point T2 of the solder powder 103 satisfy T1 ≥ T2 + 20°C, wherein the resin layer 132 shows a melt viscosity of 50 Pa·s or above and 5000 Pa·s or below, at the melting point T2 of the solder powder 103.

  连接导电元件的胶带 101 包括一个含有热固性树脂、焊粉 103 和固化剂的树脂层 132。焊粉 103 和固化剂位于树脂层 132 中，树脂层 132 的固化温度 T1 和焊粉 103 的熔点 T2 满足 T1 ≥ T2 + 20°C，其中树脂层 132 在焊粉 103 的熔点 T2 时显示出 50 Pa-s 或以上和 5000 Pa-s 或以下的熔融粘度。