申请人:SUMITOMO BAKELITE COMPANY LIMITED
公开号:EP0430220A2
公开(公告)日:1991-06-05
The present invention provides a photosensitive resin composition which comprises as essential components:
(A) a polyamic acid having a recurring unit represented by the following formula [I]:
wherein 0.5-50 mol% of R₁ consists of a silicone diamine residue represented by the following formula [II]:
wherein n represents an integer of 1-50, and the remainder of 50-99.5 mol% of R₁ consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, and a heterocyclic group, and R₂ consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, a heterocyclic group, and a silicone group, and m represents 1 or 2,
(B) an amide compound having carbon-carbon double bond, and
(C) a photosensitizer.
The present invention further provides a semiconductor apparatus in which the above composition is used.
本发明提供了一种光敏树脂组合物,其主要成分包括
(A) 具有下式[I]代表的递归单元的聚酰胺酸:
其中0.5-50 摩尔%的R₁由下式[II]代表的有机硅二胺残基组成:
其中n代表1-50的整数,其余50-99.5 mol%的R₁由选自芳香族基团、脂肪族基团、脂环族基团和杂环族基团的有机基团组成,R₂由选自芳香族基团、脂肪族基团、脂环族基团、杂环族基团和硅酮基团的有机基团组成,m代表1或2、
(B) 具有碳碳双键的酰胺化合物,和
(C) 一种光敏剂。
本发明进一步提供了一种使用上述组合物的半导体装置。