biscitraconimide of 2,4-diaminotoluene | 119465-21-3

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯啉
• 英文名称: biscitraconimide of 2,4-diaminotoluene
• 英文别名: 1,1'-(4-Methyl-1,3-phenylene)bis(3-methyl-1H-pyrrole-2,5-dione)；3-methyl-1-[4-methyl-3-(3-methyl-2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione
• CAS: 119465-21-3
• 化学式: C₁₇H₁₄N₂O₄
• 分子量: 310.309
• InChiKey: VRJJRMZNMQVVDN-UHFFFAOYSA-N

物化性质

• 沸点：
  515.2±50.0 °C(Predicted)
• 密度：
  1.389±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  23
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.18
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  在 sodium acetate 、 乙酸酐 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 3.0h， 生成 biscitraconimide of 2,4-diaminotoluene
  参考文献：
  名称：

  Chakravorty, Sukhen; Sen, Satya Ranjan, Journal of the Indian Chemical Society, 1997, vol. 74, # 4, p. 310 - 313

  摘要：

  DOI：

文献信息

• CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF PRODUCING THE SAME
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP1628363A1

  公开（公告）日：2006-02-22

  The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 µm or greater but less than 10 µm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40°C and a mean coefficient of thermal expansion of 30 to 200 ppm/°C at from 25°C to 100°C when subjected to the curing treatment.

  本发明是一种电路连接材料，用于电路板表面相邻形成电极和绝缘层的电路构件的相互连接，以及电路板表面相邻形成电极和绝缘层的电路构件的相互连接，其中边缘部分和绝缘层的厚度在主要表面的基础上大于电极的厚度，其中这种电路连接材料含有粘接剂成分和平均粒径大于或等于1微米但小于10微米且硬度为1.961至6.865GPa，并且这种电路连接材料在40℃时的存储弹性模量为0.5至3GPa，在25℃至100℃时的平均热膨胀系数为30至200ppm/℃。
• Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2182585A1

  公开（公告）日：2010-05-05

  The present invention is a circuit connecting material (10) used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member (30) in which electrodes (32) and insulating layers (33) are formed adjacent to each other on the surface (31a) of a board (31), with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition (11) and conductive particles (12) that have a mean particle size of 1 µm or greater but less than 10 µm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40°C and a mean coefficient of thermal expansion of 30 to 200 ppm/°C at from 25°C to 100°C when subjected to the curing treatment.

  本发明是一种电路连接材料(10)，用于电路板表面相邻形成电极和绝缘层的电路部件和电路板(31)表面(31a)相邻形成电极(32)和绝缘层(33)的电路部件(30)的相互连接、其中，电路连接材料包含粘接剂成分（11）和导电颗粒（12），导电颗粒（12）的平均粒径为 1 微米或更大，但小于 10 微米，硬度为 1.961至6.865GPa，并且这种电路连接材料在40℃时显示出0.5至3GPa的存储弹性模量，以及在25℃至100℃时经固化处理后显示出30至200ppm/℃的平均热膨胀系数。
• Circuit material
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2282374A1

  公开（公告）日：2011-02-09

  A circuit connecting material containing a bonding agent composition (11) and conductive particles (12). The conductive particles have a mean particle size of 1 µm or greater but less than 10 µm. The conductive particles have a hardness of between 1.961 to 6.865 GPa. The material exhibits, when subjected to a curing treatment, a storage elastic module of 0.5 to 3 GPa at 40°C, and a mean coefficient of thermal expansion of 30 to 200 ppm/°C at from 25°C to 100°C. There is also described a circuit member connecting structure (200) including the circuit connecting material described above, and a method for connecting a circuit members (30) on a circuit board (31).

  一种电路连接材料，含有粘接剂成分（11）和导电颗粒（12）。导电颗粒的平均粒径为 1 微米或更大，但小于 10 微米。导电颗粒的硬度在 1.961 至 6.865 GPa 之间。这种材料经固化处理后，在 40°C 时的储存弹性模量为 0.5 至 3 GPa，在 25°C 至 100°C 时的平均热膨胀系数为 30 至 200 ppm/°C。此外，还描述了一种包括上述电路连接材料的电路部件连接结构（200），以及一种在电路板（31）上连接电路部件（30）的方法。
• Process for the synthesis of citraconimides
  申请人：Akzo Nobel N.V.

  公开号：EP0495544B1

  公开（公告）日：1999-04-07
• CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF PRODUCING THE SAME
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP1628363B1

  公开（公告）日：2009-12-16