bis-(1-hydroxy-butyl)-peroxide | 13258-54-3

• 分子结构分类: 有机化合物 - 有机氧化合物 - 有机氧化物
• 英文名称: bis-(1-hydroxy-butyl)-peroxide
• 英文别名: Bis-(1-hydroxy-butyl)-peroxid；Bis-<1-hydroxy-butyl>-peroxid；1-(1-Hydroxybutylperoxy)butan-1-ol
• CAS: 13258-54-3
• 化学式: C₈H₁₈O₄
• 分子量: 178.229
• InChiKey: ZEEZTFCJMQHOBO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.6
• 重原子数：
  12
• 可旋转键数：
  7
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  58.9
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  丁烷 在 氧气 作用下， 生成 bis-(1-hydroxy-butyl)-peroxide
  参考文献：
  名称：

  Fujimoto, Bulletin of the Chemical Society of Japan, 1938, vol. 13, p. 287

  摘要：

  DOI：

文献信息

• Multi-layer wiring substrate and production thereof
  申请人：HITACHI, LTD.

  公开号：EP0476589A2

  公开（公告）日：1992-03-25

  A multi-layer wiring substrate for directly mounting chips or chip carriers obtained by using as adhesive layers and/or insulating layers a cured product of a special ether imide compound alone or together with at least one of aromatic cyanamide compounds, cyanurate compounds and cyanate compounds, is excellent in flexibility, solder heat resistance, high temperature fluidity and adhesiveness to copper conductors.

  一种用于直接安装芯片或芯片载体的多层布线基板，是将一种特殊的醚酰亚胺化合物单独或与芳香族氰酰胺化合物、氰尿酸酯化合物和氰酸酯化合物中的至少一种化合物一起作为粘合层和/或绝缘层固化而成的，具有优异的柔韧性、耐焊热性、高温流动性和与铜导体的粘合性。
• Eggersgluess, Angewandte Chemie, 1951, vol. 61, p. 84,85
  作者：Eggersgluess

  DOI：——

  日期：——
• SHIELDED FLAT CABLE
  申请人：Kabushiki Kaisha Bridgestone

  公开号：EP1229555B1

  公开（公告）日：2006-10-18
• Shielded flat cable
  申请人：——

  公开号：US20020189847A1

  公开（公告）日：2002-12-19

  By using a conductive adhesive prepared by dispersing conductive particles such as a nickel filler in a thermally or optically curable adhesive comprising a base resin having heat resistance and flexibility after curing, such as EVA, PVB, acrylic resin or unsaturated polyester, as an adhesive for making the shielding conductive layer of a shielded flat cable conductive with the ground line of a cable body in a non-insulated portion and bonding the cable body to the shielding member, the heat resistance and connection reliability in a high temperature and high humidity condition of the shielded flat cable are ensured. To further improve adhesion, a phosphoric acid methacrylate and melamine-based resin are blended with the above base resin.
• US4910274A
  申请人：——

  公开号：US4910274A

  公开（公告）日：1990-03-20